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SCPS123F March 2005 – January 2015 PCF8575C

PRODUCTION DATA.

封装选项

机械数据 (封装 | 引脚)

DGV|24
- MPDS006C
PW|24
- MPDS363A
DBQ|24
- MPDS211A
RGE|24
- MPQF124G
DW|24
- MPDS174A
DB|24
- MPDS509

散热焊盘机械数据 (封装 | 引脚)

RGE|24
- QFND024AD

订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage range		–0.5	6.5	V
V_I	Input voltage range⁽²⁾		–0.5	V_CC + 0.5	V
V_O	Output voltage range⁽²⁾		–0.5	V_CC + 0.5	V
I_IK	Input clamp current	V_I < 0		–20	mA
I_OK	Output clamp current	V_O < 0		–20	mA
I_OK	Input/output clamp current	V_O < 0 or V_O > V_CC		±400	μA
I_OL	Continuous output low current	V_O = 0 to V_CC		50	mA
I_OH	Continuous output high current	V_O = 0 to V_CC		–4	mA
	Continuous current through V_CC or GND			±100	mA
T_stg	Storage temperature range		–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

				VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins		2000	V
V_(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification JESD22-C101, all pins		1000	V

6.3 Recommended Operating Conditions

			MIN	MAX	UNIT
V_CC	Supply voltage		4.5	5.5	V
V_IH	High-level input voltage	A0, A1, A2, SDA, and SCL	0.7 × V_CC	V_CC + 0.5	V
V_IH	High-level input voltage	P07–P00 and P17–P10	0.8 × V_CC	V_CC + 0.5	V
V_IL	Low-level input voltage	A0, A1, A2, SDA, and SCL	–0.5	0.3 × V_CC	V
V_IL	Low-level input voltage	P07–P00 and P17–P10	–0.5	0.6 × V_CC	V
I_OHT	P-port transient pullup current			–10	mA
I_OL	P-port low-level output current			25	mA
T_A	Operating free-air temperature		–40	85	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		PCF8575						UNIT
		DB	DBQ	DGV	DW	PW	RGE
		24 PINS
R_θ_JA	Junction-to-ambient thermal resistance	63	61	86	46	88	53	°C/W

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER		TEST CONDITIONS		V_CC	MIN	TYP⁽¹⁾	MAX	UNIT
V_IK	Input diode clamp voltage	I_I = –18 mA		4.5 V to 5.5 V	–1.2			V
V_POR	Power-on reset voltage⁽²⁾	V_I = V_CC or GND,	I_O = 0	V_POR		1.2	1.8	V
I_OHT	P-port transient pullup current	High during ACK V_OH = GND		4.5 V	–0.5	–1		mA
I_OL	SDA	V_OL = 0.4 V		4.5 V to 5.5 V	3			mA
	P port	V_OL = 0.4 V		4.5 V to 5.5 V	5	15
	P port	V_OL = 1 V		4.5 V to 5.5 V	10	25
	INT	V_OL = 0.4 V		4.5 V to 5.5 V	1.6
I_I	SCL, SDA	V_I = V_CC or GND		4.5 V to 5.5 V			±2	μA
I_I	A0, A1, A2	V_I = V_CC or GND		4.5 V to 5.5 V			±1	μA
I_IHL	P port	V_I ≥ V_CC or V_I ≤ GND		4.5 V to 5.5 V			±400	μA
I_CC	Operating mode	V_I = V_CC or GND,	I_O = 0, f_SCL = 400 kHz	5.5 V		100	200	μA
I_CC	Standby mode	V_I = V_CC or GND,	I_O = 0, f_SCL = 0 kHz	5.5 V		2.5	10	μA
ΔI_CC	Supply current increase	One input at V_CC – 0.6 V, Other inputs at V_CC or GND		4.5 V to 5.5 V			200	μA
C_i	SCL	V_I = V_CC or GND		4.5 V to 5.5 V		3	7	pF
C_io	SDA	V_IO = V_CC or GND		4.5 V to 5.5 V		3	7	pF
C_io	P port	V_IO = V_CC or GND		4.5 V to 5.5 V		4	10	pF

(1) All typical values are at V_CC = 5 V, T_A = 25°C.

(2) The power-on reset circuit resets the I²C bus logic with V_CC < V_POR and sets all I/Os to logic high (with current source to V_CC).

6.6 I²C Interface Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 7)

			MIN	MAX	UNIT
f_scl	I²C clock frequency			400	kHz
t_sch	I²C clock high time		0.6		μs
t_scl	I²C clock low time		1.3		μs
t_sp	I²C spike time			50	ns
t_sds	I²C serial-data setup time		100		ns
t_sdh	I²C serial-data hold time		0		ns
t_icr	I²C input rise time		20 + 0.1C_b⁽¹⁾	300	ns
t_icf	I²C input fall time		20 + 0.1C_b⁽¹⁾	300	ns
t_ocf	I²C output fall time (10-pF to 400-pF bus)			300	ns
t_buf	I²C bus free time between stop and start		1.3		μs
t_sts	I²C start or repeated start condition setup		0.6		μs
t_sth	I²C start or repeated start condition hold		0.6		μs
t_sps	I²C stop condition setup		0.6		μs
t_vd	Valid-data time	SCL low to SDA output valid		1.2	μs
C_b	I²C bus capacitive load			400	pF

(1) C_b = total bus capacitance of one bus line in pF

6.7 Switching Characteristics

over recommended operating free-air temperature range, C_L ≤ 100 pF (unless otherwise noted) (see Figure 8 and Figure 9)

PARAMETER		FROM (INPUT)	TO (OUTPUT)	MIN	MAX	UNIT
t_iv	Interrupt valid time	P port	INT		4	μs
t_ir	Interrupt reset delay time	SCL	INT		4	μs
t_pv	Output data valid	SCL	P port		4	μs
t_su	Input data setup time	P port	SCL	0		μs
t_h	Input data hold time	P port	SCL	4		μs