SLES177B April   2006  – August 2015 PCM1808

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hardware Control
      2. 7.3.2 System Clock
      3. 7.3.3 Synchronization With Digital Audio System
      4. 7.3.4 Power On
      5. 7.3.5 Serial Audio Data Interface
        1. 7.3.5.1 Interface Mode
          1. 7.3.5.1.1 Master Mode
          2. 7.3.5.1.2 Slave Mode
        2. 7.3.5.2 Data Format
        3. 7.3.5.3 Interface Timing
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fade-In and Fade-Out Functions
      2. 7.4.2 Clock-Halt Power-Down and Reset Function
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Control Pins
        2. 8.2.2.2 Master Clock
        3. 8.2.2.3 DSP or Audio Processor
        4. 8.2.2.4 Input Filters
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 VCC, VDD Pins
      2. 10.1.2 AGND, DGND Pins
      3. 10.1.3 VINL, VINR Pins
      4. 10.1.4 VREF Pin
      5. 10.1.5 DOUT Pin
      6. 10.1.6 System Clock
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from A Revision (August 2006) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
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