ZHCS094A September   2008  – November 2014 PCM3070

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 LP38690 的
  5. 5 修订历史记录
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  Handling Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics, ADC
    6. 8.6  Electrical Characteristics, Bypass Outputs
    7. 8.7  Electrical Characteristics, Audio DAC Outputs
    8. 8.8  Electrical Characteristics, LDO
    9. 8.9  Electrical Characteristics, Misc.
    10. 8.10 Electrical Characteristics, Logic Levels
    11. 8.11 I2S LJF and RJF Timing in Master Mode (see )
    12. 8.12 I2S LJF and RJF Timing in Slave Mode (see )
    13. 8.13 DSP Timing in Master Mode (see )
    14. 8.14 DSP Timing in Slave Mode (see )
    15. 8.15 I2C Interface Timing
    16. 8.16 SPI Interface Timing (See )
    17. 8.17 Typical Characteristics
      1. 8.17.1 Typical Performance
      2. 8.17.2 Typical Characteristics, FFT
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Device Connections
        1. 10.3.1.1 Digital Pins
          1. 10.3.1.1.1 Multifunction Pins
        2. 10.3.1.2 Analog Pins
      2. 10.3.2 Analog Audio I/O
        1. 10.3.2.1 Analog Bypass
        2. 10.3.2.2 ADC Bypass Using Mixer Amplifiers
        3. 10.3.2.3 Headphone Output
        4. 10.3.2.4 Line Outputs
      3. 10.3.3 ADC
        1. 10.3.3.1 ADC Processing
          1. 10.3.3.1.1 ADC Processing Blocks
      4. 10.3.4 DAC
        1. 10.3.4.1 DAC Processing Blocks — Overview
      5. 10.3.5 Digital Audio IO Interface
      6. 10.3.6 Clock Generation and PLL
      7. 10.3.7 Control Interfaces
        1. 10.3.7.1 I2C Control
        2. 10.3.7.2 SPI Control
    4. 10.4 Device Functional Modes
      1. 10.4.1 MiniDSP
      2. 10.4.2 Software
    5. 10.5 Register Map
      1. 10.5.1 Register Map Summary
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 Reference Filtering Capacitor
      2. 11.2.2 Detailed Design Procedures
        1. 11.2.2.1 Analog Input Connection
        2. 11.2.2.2 Analog Output Connection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14器件和文档支持
    1. 14.1 文档支持
      1. 14.1.1 相关文档
    2. 14.2 商标
    3. 14.3 静电放电警告
    4. 14.4 Glossary
  15. 15机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 修订历史记录

Changes from * Revision (February 2011) to A Revision

  • 已添加引脚配置和功能部分，处理额定值表，特性 描述 部分，器件功能模式，应用和实现部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go
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