ZHCSPD6A
April 2022 – August 2022
PCM6120-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
Thermal Information
7.4
Electrical Characteristics
7.5
Timing Requirements: I2C Interface
7.6
Switching Characteristics: I2C Interface
7.7
Timing Requirements: TDM, I2S or LJ Interface
7.8
Switching Characteristics: TDM, I2S or LJ Interface
Timing Requirements: PDM Digital Microphone Interface
7.9
Switching Characteristics: PDM Digial Microphone Interface
7.10
Timing Diagrams
7.11
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Serial Interfaces
8.3.1.1
Control Serial Interfaces
8.3.1.2
Audio Serial Interfaces
8.3.1.2.1
Time Division Multiplexed Audio (TDM) Interface
8.3.1.2.2
Inter IC Sound (I2S) Interface
8.3.1.2.3
Left-Justified (LJ) Interface
8.3.1.3
Using Multiple Devices With Shared Buses
8.3.2
Phase-Locked Loop (PLL) and Clock Generation
8.3.3
Input Channel Configurations
8.3.4
Reference Voltage
8.3.5
Programmable Microphone Bias
8.3.6
Signal-Chain Processing
8.3.6.1
Programmable Channel Gain and Digital Volume Control
8.3.6.2
Programmable Channel Gain Calibration
8.3.6.3
Programmable Channel Phase Calibration
8.3.6.4
Programmable Digital High-Pass Filter
8.3.6.5
Programmable Digital Biquad Filters
8.3.6.6
Programmable Channel Summer and Digital Mixer
8.3.6.7
Configurable Digital Decimation Filters
8.3.6.7.1
Linear Phase Filters
8.3.6.7.1.1
Sampling Rate: 7.35 kHz to 8 kHz
8.3.6.7.1.2
Sampling Rate: 14.7 kHz to 16 kHz
8.3.6.7.1.3
Sampling Rate: 22.05 kHz to 24 kHz
8.3.6.7.1.4
Sampling Rate: 29.4 kHz to 32 kHz
8.3.6.7.1.5
Sampling Rate: 44.1 kHz to 48 kHz
8.3.6.7.1.6
Sampling Rate: 88.2 kHz to 96 kHz
8.3.6.7.1.7
Sampling Rate: 176.4 kHz to 192 kHz
8.3.6.7.1.8
Sampling Rate: 352.8 kHz to 384 kHz
8.3.6.7.1.9
Sampling Rate: 705.6 kHz to 768 kHz
8.3.6.7.2
Low-Latency Filters
8.3.6.7.2.1
Sampling Rate: 14.7 kHz to 16 kHz
8.3.6.7.2.2
Sampling Rate: 22.05 kHz to 24 kHz
8.3.6.7.2.3
Sampling Rate: 29.4 kHz to 32 kHz
8.3.6.7.2.4
Sampling Rate: 44.1 kHz to 48 kHz
8.3.6.7.2.5
Sampling Rate: 88.2 kHz to 96 kHz
8.3.6.7.2.6
Sampling Rate: 176.4 kHz to 192 kHz
8.3.6.7.3
Ultra-Low Latency Filters
8.3.6.7.3.1
Sampling Rate: 14.7 kHz to 16 kHz
8.3.6.7.3.2
Sampling Rate: 22.05 kHz to 24 kHz
8.3.6.7.3.3
Sampling Rate: 29.4 kHz to 32 kHz
8.3.6.7.3.4
Sampling Rate: 44.1 kHz to 48 kHz
8.3.6.7.3.5
Sampling Rate: 88.2 kHz to 96 kHz
8.3.6.7.3.6
Sampling Rate: 176.4 kHz to 192 kHz
8.3.6.7.3.7
Sampling Rate: 352.8 kHz to 384 kHz
8.3.7
Dynamic Range Enhancer (DRE)
8.3.8
Dynamic Range Compressor (DRC)
8.3.9
Automatic Gain Controller (AGC)
8.3.10
Voice Activity Detection (VAD)
8.3.11
Digital PDM Microphone Record Channel
8.3.12
Interrupts, Status, and Digital I/O Pin Multiplexing
8.4
Device Functional Modes
8.4.1
Sleep Mode or Software Shutdown
8.4.2
Active Mode
8.4.3
Software Reset
8.5
Programming
8.5.1
Control Serial Interfaces
8.5.1.1
I2C Control Interface
8.5.1.1.1
General I2C Operation
8.5.1.1.1.1
I2C Single-Byte and Multiple-Byte Transfers
8.5.1.1.1.1.1
I2C Single-Byte Write
8.5.1.1.1.1.2
I2C Multiple-Byte Write
8.5.1.1.1.1.3
I2C Single-Byte Read
8.5.1.1.1.1.4
I2C Multiple-Byte Read
8.6
Register Maps
8.6.1
Device Configuration Registers
8.6.1.1
PCM6120-Q1 Access Codes
8.6.2
Page 0 Registers
8.6.3
Page 1 Registers
8.6.4
Programmable Coefficient Registers
8.6.4.1
Programmable Coefficient Registers: Page 2
8.6.4.2
Programmable Coefficient Registers: Page 3
8.6.4.3
Programmable Coefficient Registers: Page 4
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Two-Channel Analog Microphone Recording
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.2.1
Example Device Register Configuration Script for EVM Setup
9.2.1.3
Application Curves
9.2.2
Four-Channel Digital PDM Microphone Recording
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.2.1
Example Device Register Configuration Script for EVM Setup
9.3
What to Do and What Not to Do
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
接收文档更新通知
12.3
支持资源
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
13.1
Tape and Reel Information
封装选项
机械数据 (封装 | 引脚)
RTE|20
MPQF596
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcspd6a_oa
zhcspd6a_pm
8.2
Functional Block Diagram
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