SBOS424C March   2008  – November 2015 PGA112 , PGA113 , PGA116 , PGA117

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = AVDD = DVDD = 5 V
    6. 7.6 SPI Timing: VS = AVDD = DVDD = 2.2 V to 5 V
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
    6. 8.6 Serial Interface Information
      1. 8.6.1 Serial Digital Interface: SPI Modes
      2. 8.6.2 Serial Digital Interface: SPI Daisy-Chain Communications
      3. 8.6.3 SPI Serial Interface
      4. 8.6.4 SPI Commands
  9. 9 Applications and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Op Amp: Input Stage
      2. 9.1.2 Op Amp: General Gain Equations
      3. 9.1.3 Op Amp: Frequency Response Versus Gain
        1. 9.1.3.1 Example:
      4. 9.1.4 Analog MUX
      5. 9.1.5 System Calibration Using The PGA
      6. 9.1.6 Driving and Interfacing to ADCs
      7. 9.1.7 Power Supplies
      8. 9.1.8 Shutdown and Power-On-Reset (POR)
      9. 9.1.9 Typical Connections: PGA116, PGA117 (TSSOP-20)
    2. 9.2 Typical Applications
      1. 9.2.1 Bipolar Input to Single-Supply Scaling
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Typical Application: General-Purpose Input Scaling
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 High Gain and Wide Bandwidth Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DGS|10
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from B Revision (September 2008) to C Revision

  • Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
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