SLTS278J November 2010 – March 2020 PTH08T250W
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Description (continued)
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
-
9 Application and Implementation
- 9.1
Typical Application
- 9.1.1
Detailed Design Procedure
- 9.1.1.1 Adjusting the Output Voltage
- 9.1.1.2
Capacitor Recommendations for the PTH08T250W Power Module
- 9.1.1.2.1 Capacitor Technologies
- 9.1.1.2.2 Input Capacitor (Required)
- 9.1.1.2.3 Input Capacitor Information
- 9.1.1.2.4 Output Capacitor (Required)
- 9.1.1.2.5 Output Capacitor Information
- 9.1.1.2.6 TurboTrans Output Capacitance
- 9.1.1.2.7 Non-TurboTrans Output Capacitance
- 9.1.1.2.8 Designing for Fast Load Transients
- 9.1.1.2.9 Capacitor Table
- 9.1.1.3 TurboTrans™ Technology
- 9.1.1.4 TurboTrans™ Selection
- 9.1.1.5 Undervoltage Lockout (UVLO)
- 9.1.1.6 On/Off Inhibit
- 9.1.1.7 Current Sharing
- 9.1.1.8 Prebias Startup Capability
- 9.1.1.9 SmartSync Technology
- 9.1.1.10 Auto-Track™ Function
- 9.1.1
Detailed Design Procedure
- 9.1
Typical Application
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
9.1.1.7.1.1 Current Sharing Thermal Derating Curves
The temperature derating curves in Figure 23 through Figure 26 represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to two PTH08T250W modules soldered directly to a 100 mm x 200 mm double-sided PCB with 2 oz. copper and the direction of airflow from pins 10 to pins 22. For surface mount packages (AS and AZ suffix), multiple vias must be utilized. Refer to the mechanical specification for more information.
Figure 23. Ambient Temperature vs. Output Current 
Figure 25. Ambient Temperature vs. Output Current 
Figure 24. Ambient Temperature vs. Output Current 
Figure 26. Ambient Temperature vs. Output Current