SLTS278J November 2010 – March 2020 PTH08T250W
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Description (continued)
- 6 Pin Configuration and Functions
- 7 Specifications
- 8 Detailed Description
-
9 Application and Implementation
- 9.1
Typical Application
- 9.1.1
Detailed Design Procedure
- 9.1.1.1 Adjusting the Output Voltage
- 9.1.1.2
Capacitor Recommendations for the PTH08T250W Power Module
- 9.1.1.2.1 Capacitor Technologies
- 9.1.1.2.2 Input Capacitor (Required)
- 9.1.1.2.3 Input Capacitor Information
- 9.1.1.2.4 Output Capacitor (Required)
- 9.1.1.2.5 Output Capacitor Information
- 9.1.1.2.6 TurboTrans Output Capacitance
- 9.1.1.2.7 Non-TurboTrans Output Capacitance
- 9.1.1.2.8 Designing for Fast Load Transients
- 9.1.1.2.9 Capacitor Table
- 9.1.1.3 TurboTrans™ Technology
- 9.1.1.4 TurboTrans™ Selection
- 9.1.1.5 Undervoltage Lockout (UVLO)
- 9.1.1.6 On/Off Inhibit
- 9.1.1.7 Current Sharing
- 9.1.1.8 Prebias Startup Capability
- 9.1.1.9 SmartSync Technology
- 9.1.1.10 Auto-Track™ Function
- 9.1.1
Detailed Design Procedure
- 9.1
Typical Application
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
10.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.