ZHCSCT4A September   2014  – January 2017 REF1925 , REF1930 , REF1933 , REF1941

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Thermal Hysteresis
    3. 8.3 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 VREF and VBIAS Tracking
      2. 9.3.2 Low Temperature Drift
      3. 9.3.3 Load Current
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Shunt Resistor
        2. 10.2.2.2 Differential Amplifier
        3. 10.2.2.3 Voltage Reference
        4. 10.2.2.4 Results
      3. 10.2.3 Application Curves
  11. 11Power-Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档　
    2. 13.2 相关链接
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN –0.3 6 V
EN –0.3 VIN + 0.3
Temperature Operating –55 150 °C
Junction, TJ 150
Storage, Tstg –65 170
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Supply input voltage range (IL = 0 mA, TA = 25°C) VREF + 0.02(1) 5.5 V
(1) See Figure 24 in the Typical Characteristics section for the minimum input voltage at different load currents and temperature.

7.4 Thermal Information

THERMAL METRIC(1) REF19xx UNIT
DDC (SOT23)
5 PINS
RθJA Junction-to-ambient thermal resistance 193.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 40.2 °C/W
RθJB Junction-to-board thermal resistance 34.5 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 34.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.5 Electrical Characteristics

At TA = 25°C, IL = 0 mA, and VIN = 5 V, unless otherwise noted. Both VREF and VBIAS have the same specifications.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ACCURACY AND DRIFT
Output voltage accuracy –0.1% 0.1%
Output voltage temperature coefficient(1) –40°C ≤ TA ≤ 125°C ±10 ±25 ppm/°C
VREF and VBIAS tracking over temperature(2) –40°C ≤ TA ≤ 85°C ±1.5 ±6 ppm/°C
–40°C ≤ TA ≤ 125°C ±2 ±7
LINE AND LOAD REGULATION
ΔVO(ΔVI) Line regulation VREF + 0.02 V ≤ VIN ≤ 5.5 V 3 35 ppm/V
ΔVO(ΔIL) Load regulation Sourcing 0 mA ≤ IL ≤ 20 mA ,
VREF + 0.6 V ≤ VIN ≤ 5.5 V		 8 20 ppm/mA
Sinking 0 mA ≤ IL ≤ –20 mA,
VREF + 0.02 V ≤ VIN ≤ 5.5 V 		8 20
POWER SUPPLY
ICC Supply current Active mode 360 430 µA
–40°C ≤ TA ≤ 125°C 460
Shutdown mode 3.3 5
–40°C ≤ TA ≤ 125°C 9
Enable voltage Device in shutdown mode (EN = 0) 0 0.7 V
Device in active mode (EN = 1) VIN – 0.7 VIN
Dropout voltage 10 20 mV
IL = 20 mA 600
ISC Short-circuit current 50 mA
ton Turn-on time 0.1% settling, CL = 1 µF 500 µs
NOISE
Low-frequency noise(3) 0.1 Hz ≤ f ≤ 10 Hz 12 ppmPP
Output voltage noise density f = 100 Hz 0.25 ppm/√Hz
CAPACITIVE LOAD
Stable output capacitor range 0 10 µF
HYSTERESIS AND LONG-TERM STABILITY
Long-term stability 0 to 1000 hours 60 ppm
Output voltage hysteresis(4) 25°C, –40°C, 125°C, 25°C Cycle 1 60 ppm
Cycle 2 35
(1) Temperature drift is specified according to the box method. See the Feature Description section for more details.
(2) The VREF and VBIAS tracking over temperature specification is explained in more detail in the Feature Description section.
(3) The peak-to-peak noise measurement procedure is explained in more detail in the Noise Performance section.
(4) The thermal hysteresis measurement procedure is explained in more detail in the Thermal Hysteresis section.

7.6 Typical Characteristics

At TA = 25°C, IL = 0 mA, VIN = 5-V power supply, CL = 0 µF, and 2.5-V output, unless otherwise noted.
REF1925 REF1930 REF1933 REF1941 C004_SBOS600.png
Figure 1. VREF – 2 × VBIAS Distribution
REF1925 REF1930 REF1933 REF1941 C017_SBOS600.png
–40°C ≤ TA ≤ 125°C
Figure 3. Distribution of VREF – 2 × VBIAS Drift Tracking
Over Temperature
REF1925 REF1930 REF1933 REF1941 C040_SBOS600.png
Refer to the Solder Heat Shift section for more information.
Figure 5. Solder Heat Shift Distribution (VBIAS)
REF1925 REF1930 REF1933 REF1941 C003_SBOS600.png
Figure 7. VREF – 2 × VBIAS Tracking vs Temperature
REF1925 REF1930 REF1933 REF1941 C050_SBOS600.png
VBIAS output
Figure 9. Output Voltage Change vs Load Current (VBIAS)
REF1925 REF1930 REF1933 REF1941 C020_SBOS600.png
VBIAS output IL = 20 mA
Figure 11. Load Regulation Sourcing vs Temperature (VBIAS)
REF1925 REF1930 REF1933 REF1941 C022_SBOS600.png
VBIAS output IL = –20 mA
Figure 13. Load Regulation Sinking vs Temperature (VBIAS)
REF1925 REF1930 REF1933 REF1941 C052_SBOS600.png
VBIAS output
Figure 15. Line Regulation vs Temperature (VBIAS)
REF1925 REF1930 REF1933 REF1941 C027_SBOS600.png
CL = 10 µF
Figure 17. Power-Supply Rejection Ratio vs Frequency
REF1925 REF1930 REF1933 REF1941 C042_SBOS600.png
CL = 10 µF
Figure 19. Line Transient Response
REF1925 REF1930 REF1933 REF1941 C037_SBOS600.png
CL = 10 µF IL = ±1-mA step
Figure 21. Load Transient Response
REF1925 REF1930 REF1933 REF1941 C036_SBOS600.png
CL = 10 µF IL = ±20-mA step
Figure 23. Load Transient Response
REF1925 REF1930 REF1933 REF1941 C033_SBOS600.png
CL = 1 µF
Figure 25. Turn-On Settling Time
REF1925 REF1930 REF1933 REF1941 C006_SBOS600.png
Figure 27. Quiescent Current vs Temperature
REF1925 REF1930 REF1933 REF1941 C028_SBOS600.png
VREF output
Figure 29. 0.1-Hz to 10-Hz Noise (VREF)
REF1925 REF1930 REF1933 REF1941 C030_SBOS600.png
Figure 31. Output Voltage Noise Spectrum
REF1925 REF1930 REF1933 REF1941 C023_SBOS600.png
VBIAS output
Figure 33. Output Impedance vs Frequency (VBIAS)
REF1925 REF1930 REF1933 REF1941 C014_SBOS600.png
Figure 35. Thermal Hysteresis Distribution (VBIAS)
REF1925 REF1930 REF1933 REF1941 C016_SBOS600.png
–40°C ≤ TA ≤ 85°C
Figure 2. Distribution of VREF – 2 × VBIAS Drift Tracking
Over Temperature
REF1925 REF1930 REF1933 REF1941 C041_SBOS600.png
Refer to the Solder Heat Shift section for more information.
Figure 4. Solder Heat Shift Distribution (VREF)
REF1925 REF1930 REF1933 REF1941 C001_SBOS600.png
Figure 6. Output Voltage Accuracy (VREF) vs Temperature
REF1925 REF1930 REF1933 REF1941 C038_SBOS600.png
VREF output
Figure 8. Output Voltage Change vs Load Current (VREF)
REF1925 REF1930 REF1933 REF1941 C025_SBOS600.png
VREF output IL = 20 mA
Figure 10. Load Regulation Sourcing vs Temperature (VREF)
REF1925 REF1930 REF1933 REF1941 C021_SBOS600.png
VREF output IL = –20 mA
Figure 12. Load Regulation Sinking vs Temperature (VREF)
REF1925 REF1930 REF1933 REF1941 C019_SBOS600.png
VREF output
Figure 14. Line Regulation vs Temperature (VREF)
REF1925 REF1930 REF1933 REF1941 C026_SBOS600.png
CL = 0 µF
Figure 16. Power-Supply Rejection Ratio vs Frequency
REF1925 REF1930 REF1933 REF1941 C043_SBOS600.png
CL = 1 µF
Figure 18. Line Transient Response
REF1925 REF1930 REF1933 REF1941 C051_SBOS600.png
CL = 1 µF IL = ±1-mA step
Figure 20. Load Transient Response
REF1925 REF1930 REF1933 REF1941 C049_SBOS600.png
CL = 1 µF IL = ±20-mA step
Figure 22. Load Transient Response
REF1925 REF1930 REF1933 REF1941 C005_SBOS600.png
Figure 24. Minimum Dropout Voltage vs Load Current
REF1925 REF1930 REF1933 REF1941 C034_SBOS600.png
CL = 10 µF
Figure 26. Turn-On Settling Time
REF1925 REF1930 REF1933 REF1941 C007_SBOS600.png
Figure 28. Quiescent Current vs Input Voltage
REF1925 REF1930 REF1933 REF1941 C029_SBOS600.png
VBIAS output
Figure 30. 0.1-Hz to 10-Hz Noise (VBIAS)
REF1925 REF1930 REF1933 REF1941 C024_SBOS600.png
VREF output
Figure 32. Output Impedance vs Frequency (VREF)
REF1925 REF1930 REF1933 REF1941 C013_SBOS600.png
Figure 34. Thermal Hysteresis Distribution (VREF)
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