11.1 Layout Guidelines

Figure 33 illustrates an example of a printed-circuit board (PCB) layout using the REF31xx. Some key considerations are:

• Connect low-ESR, 0.1-μF ceramic bypass capacitors at V_IN of the REF31xx
• Decouple other active devices in the system per the device specifications
• Use a solid ground plane to help distribute heat and reduces electromagnetic interference (EMI) noise pickup
• Place the external components as close to the device as possible. This configuration prevents parasitic errors (such as the Seebeck effect) from occurring
• Minimize trace length between the reference and bias connections to the INA and ADC to reduce noise pickup
• Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when absolutely necessary

11.2 Layout Example

Figure 33. Layout Example