ZHCSSS4 august   2023 REF35-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Device Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. Parameter Measurement Information
    1. 8.1 Solder Heat Shift
    2. 8.2 Temperature Coefficient
    3. 8.3 Long-Term Stability
    4. 8.4 Thermal Hysteresis
    5. 8.5 Noise Performance
      1. 8.5.1 Low-Frequency (1/f) Noise
      2. 8.5.2 Broadband Noise
    6. 8.6 Power Dissipation
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply Voltage
      2. 9.3.2 EN Pin
      3. 9.3.3 NR Pin
    4. 9.4 Device Functional Modes
      1. 9.4.1 Basic Connections
      2. 9.4.2 Start-Up
      3. 9.4.3 Output Transient Behavior
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application: Negative Reference Voltage
    3. 10.3 Typical Application: Precision Power Supply and Reference
      1. 10.3.1 Design Requirements
      2. 10.3.2 Detailed Design Procedure
        1. 10.3.2.1 Selection of Reference
        2. 10.3.2.2 Input and Output Capacitors
        3. 10.3.2.3 Selection of ADC
      3. 10.3.3 Application Curves
    4. 10.4 Power Supply Recommendations
    5. 10.5 Layout
      1. 10.5.1 Layout Guidelines
      2. 10.5.2 Layout Examples
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Power Dissipation

The REF35-Q1 voltage references are capable of source up to 10 mA and sink up to 5 mA of load current across the rated input voltage range. However, when used in applications subject to high ambient temperatures, the input voltage and load current must be carefully monitored to ensure that the device does not exceeded its maximum power dissipation rating. The maximum power dissipation of the device can be calculated with Equation 3:

Equation 3. GUID-3392B7D4-B78F-486E-8592-49342ACEEB54-low.gif

where

  • PD is the device power dissipation
  • TJ is the device junction temperature
  • TA is the ambient temperature
  • RθJA is the package (junction-to-air) thermal resistance

Because of this relationship, acceptable load current in high temperature conditions may be less than the maximum current-sourcing capability of the device. In no case should the device be operated outside of its maximum power rating because doing so can result in premature failure or permanent damage to the device.