10.1 Layout Guidelines

• Place the power-supply bypass capacitor as closely as possible to the VIN pin and ground pins. TI recommends a bypass capacitor value of 1 μF to 10 μF. If necessary, additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies.
• Place a 1-µF noise filtering capacitor between the NR pin and ground.
• The output must be decoupled with a 1-µF to 50-µF capacitor. In series with the load capacitor, add an ESR of 1-Ω for the best noise performance.
• A high-frequency, 1-µF capacitor can be added in parallel between the output and ground to filter noise and help with switching loads as data converters.

10.2 Layout Example

Figure 37. Recommended Layout for REF5025-HT

10.3 Power Dissipation

The REF50xx family is specified to deliver current loads of ±10-mA over the specified input voltage range. The temperature of the device increases according to Equation 3:

The REF50xx junction temperature must not exceed the absolute maximum rating of +150°C.