ZHCSFI5 September   2016 REF6225 , REF6230 , REF6233 , REF6241 , REF6245 , REF6250

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Device Comparison Table
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
    2. 7.2 Thermal Hysteresis
    3. 7.3 Reference Droop Measurements
    4. 7.4 1/f Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Integrated ADC Drive Buffer
      2. 8.3.2 Temperature Drift
      3. 8.3.3 Load Current
      4. 8.3.4 Stability
    4. 8.4 Device Functional Modes
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Results
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 相关链接
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input voltage VIN –0.3 6 V
VEN –0.3 VIN + 0.3 V
Operating temperature, TA –55 150 °C
Junction temperature, Tj 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN Supply input voltage
(IOUT = 0 mA)		 REF6225 3 5.5 V
REF6230, REF6233, REF6241, REF6245 VOUT + 0.25 5.5
REF6250 5.3 5.5
VEN Enable voltage 0 VIN V
IL Output current REF6225, REF6230, REF6233, REF6241 –4 4 mA
REF6245 –3.5 3.5
REF6250 –3 3
TA Operating temperature 0 25 70 °C

6.4 Thermal Information

THERMAL METRIC(1) REF62xx UNIT
DGK (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 158.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.2 °C/W
RθJB Junction-to-board thermal resistance 79.5 °C/W
ψJT Junction-to-top characterization parameter 5.2 °C/W
ψJB Junction-to-board characterization parameter 78.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

at TA = 25°C, VIN = 5 V for all devices except REF6250, VIN = 5.4 V for REF6250, IL = 0 mA, CL = 22 µF, CFILT = 1 µF, and VEN = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ACCURACY AND DRIFT
Output voltage accuracy -0.05% 0.05%
Output voltage temperature coefficient(1) 3 ppm/°C
LINE AND LOAD REGULATION
ΔVO(ΔVI) Line regulation REF6225 VOUT + 0.5 V ≤ VIN ≤ 5.5 V TA = 25°C 4 20 ppm/V
TA = 0°C to +70°C 30
REF6230, REF6233, REF6241, REF6245 VOUT + 0.25 V ≤ VIN ≤ 5.5 V TA = 25°C 4 20
TA = 0°C to +70°C 30
REF6250 VOUT + 0.3 V ≤ VIN ≤ 5.5 V TA = 25°C 7 60
TA = 0°C to +70°C 120
ΔVO(ΔIL) Load regulation, sourcing and sinking REF6225, REF6230, REF6233, REF6241 IL = 0 mA to 4 mA,
VIN = VOUT + 600 mV		 TA = 25°C 2 20 ppm/mA
TA = 0°C to +70°C 30
REF6245 IL = 0 mA to 3.5 mA,
VIN = VOUT + 600 mV		 TA = 25°C 2 20
TA = 0°C to +70°C 30
REF6250 IL = 0 mA to 3 mA,
VIN = VOUT + 400 mV		 TA = 25°C 2 20
TA = 0°C to +70°C 50
ISC Short-circuit current SS = open 10.5 mA
NOISE
Total integrated noise CL = 22 µF 5 µVRMS
CL = 47 µF 5
Low frequency noise 0.1 Hz ≤ f ≤ 10 Hz 3 µVPP/V
OUTPUT IMPEDANCE
Output impedance f = DC to 200 kHz, CL= 47 μF 50 mΩ
TURN-ON TIME
ton Turn-on time 0.1% settling, CL = 47 µF, SS = open, REF6225 100 ms
HYSTERESIS AND LONG TERM DRIFT
Long term stability 0 to 1000h at 25°C 80 ppm
1000h to 2000h at 25°C 20
Output voltage hysteresis(2) 25°C, 0°C, 70°C, 25°C (cycle 1) 33 ppm
25°C, 0°C, 70°C, 25°C (cycle 2) 8
CAPACITIVE LOAD
CL Stable output capacitor value 10 47 µF
OUTPUT VOLTAGE
VOUT Output voltage REF6225 2.5 V
REF6230 3
REF6233 3.3
REF6241 4.096
REF6245 4.5
REF6250 5
POWER SUPPLY
ICC Supply current REF6225, REF6230, REF6233, REF6241 Active mode, VEN = 5 V TA = 25°C 0.82 0.90 mA
TA = –40°C to +125°C 1.1
REF6245, REF6250 Active mode, VEN = 5 V TA = 25°C 0.83 0.95
TA = –40°C to +125°C 1.15
Shutdown mode, VEN = 0 V TA = 25°C 1 3 µA
TA = –40°C to +125°C 15
Enable pin voltage Voltage reference in active mode (EN = 1) 1.6 V
Voltage reference in shutdown mode (EN = 0) 0.6
Enable pin current VEN = 5 V 100 150 nA
Dropout voltage REF6225 IL = 0 mA 500 500 mV
IL = 4 mA 600
REF6230, REF6233, REF6241 IL = 0 mA 50 250
IL = 4 mA 600
REF6245 IL = 0 mA 50 250
IL = 3.5 mA 600
REF6250 IL = 0 mA 100 300
IL = 3 mA 400
(1) Temperature drift is specified according to the box method. See the Feature Description section for more details.
(2) See the Thermal Hysteresis section.

6.6 Typical Characteristics

at TA = 25°C, IL = 0 mA, and VIN = 5 V, using REF6225 (unless otherwise noted)
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C002_SBOS748.png
TA = 0°C to +70°C
Figure 1. Drift Distribution
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C004_SBOS708.png
Figure 3. Solder-Heat Shift Distribution
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C017_SBOS708.png
Figure 5. Dropout Voltage vs Load Current
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C007_SBOS748.png
VIN = VOUT + 600 mV,
IL = 0 mA to 4 mA
Figure 7. Load Regulation Sinking vs Temperature
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C019_SBOS748.png
Figure 9. Supply Current vs Temperature
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C018_SBOS708.png
Figure 11. Turn-On Settling Time
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C022_SBOS708.png
Figure 13. Output-Voltage Noise Spectrum
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C025_SBOS708.png
Graph obtained by design simulation
Figure 15. Output Impedance vs Frequency
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C015_SBOS708.png
Load current = ±3 mA
Figure 17. Load Transient Response
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C028_SBOS748.png
Figure 19. Thermal Hysteresis Distribution (Cycle 1)
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C063_SBOS748.png
Figure 21. Output Impedance Comparison
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C037_SBOS708.png
REF6250 driving REF pin of ADS8881,
fIN = 2 kHz, SNR = 100.4 dB, THD = –123.9 dB
Figure 23. Typical FFT Plot
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C030_SBOS708.png
REF6241 driving REF pin of ADS8881,
fIN = 1 kHz, SNR = 99 dB, THD = –124.4 dB
Figure 25. Typical FFT Plot
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C032_SBOS708.png
REF6241 driving REF pin of ADS8881,
fIN = 10 kHz, SNR = 97.2 dB, THD = –119.7 dB
Figure 27. Typical FFT Plot
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C034_SBOS708.png
REF6225 driving REF pin of ADS8881,
fIN = 2 kHz, SNR = 95.4 dB, THD = –123.5 dB
Figure 29. Typical FFT Plot
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C047_SBOS708.png
REF6250 driving REF pin of ADS8881 operating at 1 MSPS,
positive full-scale input to ADS8881
Figure 31. Reference Droop
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C049_SBOS708.png
REF6250 driving REF pin of ADS8881 operating at 1 MSPS,
AINP = AINN = VREF / 2 for ADS8881
Figure 33. Reference Droop
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C051_SBOS708.png
AINP = AINN = VREF / 2 for ADS8881,
sampling rate = 500 kSPS
Figure 35. DC Input Histogram
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C053_SBOS708.png
AINP = AINN = VREF / 2 for ADS8881,
sampling rate = 20 kSPS
Figure 37. DC Input Histogram
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C005_SBOS708.png
Figure 2. Initial Accuracy Distribution
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C001_SBOS748.png
Figure 4. Output Voltage Accuracy vs Temperature
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C006_SBOS748.png
VIN = VOUT + 600 mV,
IL = 0 mA to 4 mA
Figure 6. Load Regulation Sourcing vs Temperature
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C010_SBOS708.png
VOUT + 0.25 V ≤ VIN ≤ 5.5 V
Figure 8. Line Regulation vs Temperature
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C020_SBOS708.png
Figure 10. Supply Current vs Input Voltage
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C021_SBOS708.png
Figure 12. 0.1-Hz to 10-Hz Noise
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C011_SBOS708.png
Figure 14. PSRR vs Frequency
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C014_SBOS708.png
Load current = ±1 mA
Figure 16. Load Transient Response
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C013_SBOS708.png
Figure 18. Line Transient Response
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C027_SBOS748.png
Figure 20. Thermal Hysteresis Distribution (Cycle 2)
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C024_SBOS708.png
REF6250 driving REF pin of ADS8881,
fIN = 1 kHz, SNR = 100.5 dB, THD = –125.9 dB
Figure 22. Typical FFT Plot
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C038_SBOS708.png
REF6250 driving REF pin of ADS8881,
fIN = 10 kHz, SNR = 99.2 dB, THD = –119.4 dB
Figure 24. Typical FFT Plot
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C031_SBOS708.png
REF6241 driving REF pin of ADS8881,
fIN = 2 kHz, SNR = 99 dB, THD = –123.6 dB
Figure 26. Typical FFT Plot
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C033_SBOS708.png
REF6225 driving REF pin of ADS8881,
fIN = 1 kHz, SNR = 95.4 dB, THD = –124 dB
Figure 28. Typical FFT Plot
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C035_SBOS708.png
REF6225 driving REF pin of ADS8881,
fIN = 10 kHz, SNR = 94.0 dB, THD = –119.3 dB
Figure 30. Typical FFT Plot
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C048_SBOS708.png
REF6250 driving REF pin of ADS8881 operating at 1 MSPS,
negative full-scale input to ADS8881
Figure 32. Reference Droop
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C050_SBOS708.png
AINP = AINN = VREF / 2 for ADS8881,
sampling rate = 1 MSPS
Figure 34. DC Input Histogram
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C052_SBOS708.png
AINP = AINN = VREF / 2 for ADS8881,
sampling rate = 100 kSPS
Figure 36. DC Input Histogram
REF6225 REF6230 REF6233 REF6241 REF6245 REF6250 C042_SBOS748.png
1 LSB = 19.07 µV, with ADS8881 at 1 MSPS
Figure 38. Reference Droop Comparison
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