SGUS033A February   2002  – May 2016 SMJ320C6203

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Description (continued)
  5. 5 Characteristics of the C6203 DSP
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Recommended Operating Conditions
    3. 7.3  Thermal Information
    4. 7.4  Electrical Characteristics
    5. 7.5  Timing Requirements for CLKIN (PLL Used)
    6. 7.6  Timing Requirements for CLKIN [PLL Bypassed (x1)]
    7. 7.7  Timing Requirements for XCLKIN
    8. 7.8  Timing Requirements for Asynchronous Memory Cycles
    9. 7.9  Timing Requirements for Synchronous-Burst SRAM Cycles
    10. 7.10 Timing Requirements for Synchronous DRAM Cycles
    11. 7.11 Timing Requirements for the HOLD/HOLDA Cycles
    12. 7.12 Timing Requirements for Reset
    13. 7.13 Timing Requirements for Interrupt Response Cycles
    14. 7.14 Timing Requirements for Synchronous FIFO Interface
    15. 7.15 Timing Requirements for Asynchronous Peripheral Cycles
    16. 7.16 Timing Requirements With External Device as Bus Master
    17. 7.17 Timing Requirements With C62x as Bus Master
    18. 7.18 Timing Requirements With External Device as Asynchronous Bus Master
    19. 7.19 Timing Requirements for Expansion Bus Arbitration (Internal Arbiter Enabled)
    20. 7.20 Timing Requirements for McBSP
    21. 7.21 Timing Requirements for FSR when GSYNC = 1
    22. 7.22 Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
    23. 7.23 Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
    24. 7.24 Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
    25. 7.25 Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
    26. 7.26 Timing Requirements for Timer Inputs
    27. 7.27 Timing Requirements for JTAG Test Port
    28. 7.28 Switching Characteristics for CLKOUT2
    29. 7.29 Switching Characteristics for XFCLK
    30. 7.30 Asynchronous Memory Timing Switching Characteristics
    31. 7.31 Switching Characteristics for Synchronous-Burst SRAM Cycles
    32. 7.32 Switching Characteristics for Synchronous DRAM Cycles
    33. 7.33 Switching Characteristics for the HOLD/HOLDA Cycles
    34. 7.34 Switching Characteristics for Reset
    35. 7.35 Switching Characteristics for Interrupt Response Cycles
    36. 7.36 Switching Characteristics for Synchronous FIFO Interface
    37. 7.37 Switching Characteristics for Asynchronous Peripheral Cycles
    38. 7.38 Switching Characteristics With External Device as Bus Master
    39. 7.39 Switching Characteristics With C62x as Bus Master
    40. 7.40 Switching Characteristics With External Device as Asynchronous Bus Master
    41. 7.41 Switching Characteristics for Expansion Bus Arbitration (Internal Arbiter Enabled)
    42. 7.42 Switching Characteristics for Expansion Bus Arbitration (Internal Arbiter Disabled)
    43. 7.43 Switching Characteristics for McBSP
    44. 7.44 Switching Characteristics for McBSP as SPI Master or Slave
    45. 7.45 Switching Characteristics for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
    46. 7.46 Switching Characteristics for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
    47. 7.47 Switching Characteristics for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
    48. 7.48 Switching Characteristics for DMAC Outputs
    49. 7.49 Switching Characteristics for Timer Outputs
    50. 7.50 Switching Characteristics for Power-Down Outputs
    51. 7.51 Switching Characteristics for JTAG Test Port
  8. 8 Parameter Measurement Information
    1. 8.1 Signal Transition Levels
    2. 8.2 Timing Parameters and Board Routing Analysis
  9. 9 Detailed Description
    1. 9.1 Functional Block Diagram
    2. 9.2 Feature Description
      1. 9.2.1 Signal Groups Description
      2. 9.2.2 CPU (DSP Core) Description
      3. 9.2.3 Clock PLL
    3. 9.3 Register Maps
      1. 9.3.1 Memory Map Summary
      2. 9.3.2 Peripheral Register Descriptions
      3. 9.3.3 Interrupt Sources and Interrupt Selector
  10. 10Application and Implementation
    1. 10.1 Typical Application
      1. 10.1.1 Detailed Design Procedure
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Sequencing
    2. 11.2 System-Level Design Considerations
    3. 11.3 Power-Supply Design Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Software Development Tools
        2. 12.1.2.2 Hardware Development Tools
      3. 12.1.3 Device and Development-Support Tool Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.1.2 Development Support

TI offers an extensive line of development tools for the TMS320C6000 DSP platform, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules.

The following products support development of C6000 DSP-based applications:

12.1.2.1 Software Development Tools

Code Composer Studio™ Integrated Development Environment (IDE) including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software needed to support any DSP application.

12.1.2.2 Hardware Development Tools

Extended Development System (XDS™) Emulator (supports C6000 DSP multiprocessor system debug) EVM (Evaluation Module)

The TMS320 DSP Development Support Reference Guide (SPRU011) contains information about development-support products for all TMS320 DSP family member devices, including documentation. See this document for further information on TMS320 DSP documentation or any TMS320 DSP support products from Texas Instruments. An additional document, the TMS320 Third-Party Support Reference Guide (SPRU052), contains information about TMS320 DSP-related products from other companies in the industry. To receive TMS320 DSP literature, contact the Literature Response Center at 800/477-8924.

For a complete listing of development-support tools for the TMS320C6000 DSP platform, visit the Texas Instruments web site at www.ti.com and select “Find Development Tools”. For device-specific tools, under “Semiconductor Products” select “Digital Signal Processors”, choose a product family, and select the particular DSP device. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

12.1.3 Device and Development-Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all SMJ320 DSP devices and support tools. Each SMJ320 DSP commercial family member has one of three prefixes: SMX, SM, or SMJ. Texas Instruments recommends two of three possible prefix designators for support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (SMX/TMDX) through fully qualified production devices/tools (SMJ/TMDS).

Device development evolutionary flow:

    SMX Experimental device that is not necessarily representative of the final device’s electrical specifications
    SM Final silicon die that conforms to the device’s electrical specifications but has not completed quality and reliability verification
    SMJ Fully qualified production device processed to MIL-PRF-38535

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully qualified development-support product

SMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:

“Developmental product is intended for internal evaluation purposes.”

SMJ devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI’s standard warranty applies.

Predictions show that prototype devices (SMX or SM) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, GLP), the temperature range, and the device speed range in megahertz (for example, 20 is 200 MHz).

Figure 56 provides a legend for reading the complete device name. For the C6203 device orderable part numbers (P/Ns), see the Texas Instruments web site at www.ti.com, or contact the nearest TI field sales office, or authorized distributor.

SMJ320C6203 dev_nomenclature_gus033.gif Figure 56. SMJ320C6000 DSP Platform Device Nomenclature

12.2 Documentation Support

12.2.1 Related Documentation

Extensive documentation supports all SMJ320 DSP family devices from product announcement through applications development. The types of documentation available include: data sheets, such as this document, with design specifications; complete user’s reference guides for all devices and tools; technical briefs; development-support tools; on-line help; and hardware and software applications. The following is a brief, descriptive list of support documentation specific to the C6000 DSP devices:

The TMS320C6000 CPU and Instruction Set Reference Guide (SPRU189) describes the C6000 CPU (DSP core) architecture, instruction set, pipeline, and associated interrupts.

The TMS320C6000 Peripherals Reference Guide (SPRU190) describes the functionality of the peripherals available on the C6000 DSP platform of devices, such as the 64-/32-/16-bit external memory interfaces (EMIFs), 32-/16-bit host-port interfaces (HPIs), multichannel buffered serial ports (McBSPs), direct memory access (DMA), enhanced direct-memory-access (EDMA) controller, expansion bus, peripheral component interconnect (PCI), clocking and phase-locked loop (PLL); and power-down modes. This guide also includes information on internal data and program memories.

The TMS320C6000 Technical Brief (SPRU197) gives an introduction to the TMS320C62x/TMS320C67x devices, associated development tools, and third-party support.

The tools support documentation is electronically available within the Code Composer Studio™ IDE. For a complete listing of the latest C6000 DSP documentation, visit the Texas Instruments website at www.ti.com.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

C6000, Code Composer Studio, DSP/BIOS, XDS, E2E are trademarks of Texas Instruments.

Windows is a registered trademark of Microsoft Corporation.

Motorola is a registered trademark of Motorola Trademark Holdings, LLC.

SMJ320C62x, VelociTI, C62x are trademarks of TI.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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