ZHCSK05D July   2019  – October 2022 SN3257-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8.     Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  IPOFF Leakage Current
    5. 7.5  Transition Time
    6. 7.6  tON (EN) and tOFF (EN) Time
    7. 7.7  tON (VDD) and tOFF (VDD) Time
    8. 7.8  Break-Before-Make Delay
    9. 7.9  Propagation Delay
    10. 7.10 Skew
    11. 7.11 Charge Injection
    12. 7.12 Capacitance
    13. 7.13 Off Isolation
    14. 7.14 Channel-to-Channel Crosstalk
    15. 7.15 Bandwidth
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Beyond Supply Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Powered-off Protection
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Integrated Pull-Down Resistors
    4. 8.4 Device Functional Modes
      1. 8.4.1 Truth Tables
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Pin Configuration and Functions

Figure 5-1 PW Package,
16-Pin TSSOP
(Top View)
Figure 5-2 DYY Package,
16-Pin SOT-23
(Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION(2)
NAME NO.
SEL 1 I Select pin: controls state of switches according to Table 8-1. Internal 6 MΩ pull-down to GND.
S1A 2 I/O Source pin 1A. Can be an input or output.
S1B 3 I/O Source pin 1B. Can be an input or output.
D1 4 I/O Drain pin 1. Can be an input or output.
S2A 5 I/O Source pin 2A. Can be an input or output.
S2B 6 I/O Source pin 2B. Can be an input or output.
D2 7 I/O Drain pin 2. Can be an input or output.
GND 8 P Ground (0 V) reference
D3 9 I/O Drain pin 3. Can be an input or output.
S3B 10 I/O Source pin 3B. Can be an input or output.
S3A 11 I/O Source pin 3A. Can be an input or output.
D4 12 I/O Drain pin 4. Can be an input or output.
S4B 13 I/O Source pin 4B. Can be an input or output.
S4A 14 I/O Source pin 4A. Can be an input or output.
EN 15 I Active low enable: When this pin is high, all switches are turned off. When this pin is low, SEL pin controls the signal path selection. Internal 6 MΩ pull-down to GND.
VDD 16 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.
I = input, O = output, I/O = input and output, P = power
Refer to Section 8.4 for what to do with unused pins.