ZHCSK05D July 2019 – October 2022 SN3257-Q1
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Parameter Measurement Information
- 7.1 On-Resistance
- 7.2 Off-Leakage Current
- 7.3 On-Leakage Current
- 7.4 IPOFF Leakage Current
- 7.5 Transition Time
- 7.6 tON (EN) and tOFF (EN) Time
- 7.7 tON (VDD) and tOFF (VDD) Time
- 7.8 Break-Before-Make Delay
- 7.9 Propagation Delay
- 7.10 Skew
- 7.11 Charge Injection
- 7.12 Capacitance
- 7.13 Off Isolation
- 7.14 Channel-to-Channel Crosstalk
- 7.15 Bandwidth
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
12.5 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |