SDLS025D December   1983  – May 2017 SN5400 , SN54LS00 , SN54S00 , SN7400 , SN74LS00 , SN74S00

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings: SN74LS00
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: SNx400
    6. 6.6  Electrical Characteristics: SNx4LS00
    7. 6.7  Electrical Characteristics: SNx4S00
    8. 6.8  Switching Characteristics: SNx400
    9. 6.9  Switching Characteristics: SNx4LS00
    10. 6.10 Switching Characteristics: SNx4S00
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Propagation Delays, Setup and Hold Times, and Pulse Width
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • J|14
  • W|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage, VCC(2) 7 V
Input voltage SNx400 and SNxS400 5.5 V
SNx4LS00 7
Junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Voltage values are with respect to network ground terminal.

6.2 ESD Ratings: SN74LS00

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance. ESD Tested on SN74LS00N package.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage SN54xx00 4.5 5 5.5 V
SN74xx00 4.75 5 5.25
VIH High-level input voltage 2 V
VIL Low-level input voltage SNx400, SN7LS400, and SNx4S00 0.8 V
SN54LS00 0.7
IOH High-level output current SN5400, SN54LS00, and SN74LS00 –0.4 mA
SNx4S00 –1
IOL Low-level output current SNx400 16 mA
SN5LS400 4
SN7LS400 8
SNx4S00 20
TA Operating free-air temperature SN54xx00 –55 125 °C
SN74xx00 0 70

6.4 Thermal Information

THERMAL METRIC(1)(2) SN74LS00 UNIT
D (SOIC) DB (SSOP) N (PDIP) NS (SO)
14 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 90.9 102.8 54.8 89.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.9 53.3 42.1 48.1 °C/W
RθJB Junction-to-board thermal resistance 48 53.4 34.8 50.1 °C/W
ψJT Junction-to-top characterization parameter 18.6 16.5 26.9 16.7 °C/W
ψJB Junction-to-board characterization parameter 47.8 52.9 34.7 49.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.

6.5 Electrical Characteristics: SNx400

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIK VCC = MIN and II = –12 mA –1.5 V
VOH VCC = MIN, VIL = 0.8 V, and IOH = –0.4 mA 2.4 3.4 V
VOL VCC = MIN, VIH = 2 V, and IOL = 16 mA 0.2 0.4 V
II VCC = MAX and VI = 5.5 V 1 mA
IIH VCC = MAX and VI = 2.4 V 40 µA
IIL VCC = MAX and VI = 0.4 V –1.6 mA
IOS VCC = MAX SN5400 –20 –55 mA
SN7400 –18 –55
ICCH VCC = MAX and VI = 0 V 4 8 mA
ICCL VCC = MAX and VI = 4.5 V 12 22 mA

6.6 Electrical Characteristics: SNx4LS00

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIK VCC = MIN and II = –18 mA –1.5 V
VOH VCC = MIN, VIL = MAX, and IOH = –0.4 mA 2.5 3.4 V
VOL VCC = MIN and VIH = 2 V IOL = 4 mA 0.25 0.4 V
IOL = 8 mA (SN74LS00) 0.35 0.5
II VCC = MAX and VI = 7 V 0.1 mA
IIH VCC = MAX and VI = 2.7 V 20 µA
IIL VCC = MAX and VI = 0.4 V –0.4 mA
IOS VCC = MAX –20 –100 mA
ICCH VCC = MAX and VI = 0 V 0.8 1.6 mA
ICCL VCC = MAX and VI = 4.5 V 2.4 4.4 mA

6.7 Electrical Characteristics: SNx4S00

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIK VCC = MIN and II = –18 mA –1.2 V
VOH VCC = MIN, VIL = 0.8 V, and IOH = –1 mA 2.5 3.4 V
VOL VCC = MIN, VIH = 2 V, and IOL = 20 mA 0.5 V
II VCC = MAX and VI = 5.5 V 1 mA
IIH VCC = MAX and VI = 2.7 V 50 µA
IIL VCC = MAX and VI = 0.5 V –2 mA
IOS VCC = MAX –40 –100 mA
ICCH VCC = MAX and VI = 0 V 10 16 mA
ICCL VCC = MAX and VI = 4.5 V 20 36 mA

6.8 Switching Characteristics: SNx400

VCC = 5 V, TA = 25°C, and over operating free-air temperature range (unless otherwise noted). See Figure 2.
PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS MIN TYP MAX UNIT
tPLH A or B Y RL = 400 Ω and CL = 15 pF 11 22 ns
tPHL 7 15

6.9 Switching Characteristics: SNx4LS00

VCC = 5 V, TA = 25°C, and over operating free-air temperature range (unless otherwise noted). See Figure 2.
PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS MIN TYP MAX UNIT
tPLH A or B Y RL = 2 kΩ and CL = 15 pF 9 15 ns
tPHL 10 15

6.10 Switching Characteristics: SNx4S00

VCC = 5 V, TA = 25°C, and over operating free-air temperature range (unless otherwise noted). See Figure 2.
PARAMETER FROM (INPUT) TO (OUTPUT) TEST CONDITIONS MIN TYP MAX UNIT
tPLH A or B Y RL = 280 Ω and CL = 15 pF 3 4.5 ns
RL = 280 Ω and CL = 50 pF 4.5
tPHL A or B Y RL = 280 Ω and CL = 15 pF 3 5
RL = 280 Ω and CL = 50 pF 5

6.11 Typical Characteristics

CL = 15 pF
SN5400 SN54LS00 SN54S00 SN7400 SN74LS00 SN74S00 D002_sdls025.gif Figure 1. TPHL (Across Devices)
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