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ZHCSP38C October 2008 – April 2022 SN54AC00-SP

PRODUCTION DATA

6.3 Thermal Information

THERMAL METRIC⁽¹⁾⁽²⁾		SN54AC00-SP		UNIT
		J	W
		14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	83.1	125.4	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	26.6	30.85
R_θJB	Junction-to-board thermal resistance	47.9	43.4
ψ_JT	Junction-to-top characterization parameter	N/A	N/A
ψ_JB	Junction-to-board characterization parameter	N/A	N/A
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2) The package thermal impedance is calculated in accordance with JESD 51-7 and Mil Std 883 method 1012.1 (see www.JEDEC.org).