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ZHCSS89S December 1995 – February 2024 SN54AHCT126 , SN74AHCT126

PRODUCTION DATA

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AHCT126							UNIT
		D	DB	DGV	N	NS	PW	BQA
		14 PINS
R_θJA	Junction-to-ambient thermal resistance	124.5	107.1	129.0	57.4	120.9	147.7	88.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	78.8	59.6	52.1	44.9	78.2	77.4	90.9
R_θJB	Junction-to-board thermal resistance	81	54.4	62.0	37.2	81.6	90.9	56.8
ψ_JT	Junction-to-top characterization parameter	37	20.5	6.5	30.1	42.8	27.2	9.9
ψ_JB	Junction-to-board characterization parameter	80.6	53.8	61.3	37.1	81.1	90.2	56.7
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	N/A	N/A	33.4

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).