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ZHCSR24T October 1995 – October 2023 SN54AHCT14 , SN74AHCT14

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AHCT14								UNIT
		D	DGV	DB	N	NS	PW	RGY	BQA
		14 PINS
R_θJA	Junction-to-ambient thermal resistance	124.5	138.7	113.1	61.1	98.6	147.7	63.7	88.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	78.8	60.6	65.6	48.0	54.1	77.4	77.6	90.9
R_θJB	Junction-to-board thermal resistance	81	71.8	60.4	41.0	57.4	90.9	39.7	56.8
ψ_JT	Junction-to-top characterization parameter	37	10.6	25.5	32.4	19.6	27.2	5.7	9.9
ψ_JB	Junction-to-board characterization parameter	80.6	71.1	59.9	40.9	57.0	90.2	39.9	56.7
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	N/A	N/A	19.9	33.4

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, (SPRA953).