米6体育平台手机版

ZHCSHK0O October 1995 – July 2024 SN54AHCT240 , SN74AHCT240

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AHCT240					UNIT
		DW (SOIC)	DB (SSOP)	N (PDIP)	NS (SOP	PW (TSSOP)
		20 PINS	20 PINS	20 PINS	20 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance	81.1	99.9	54.9	80.4	116.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	48.9	61.7	41.7	46.9	58.5
R_θJB	Junction-to-board thermal resistance	53.8	55.2	35.8	47.9	78.7
ψ_JT	Junction-to-top characterization parameter	19.5	22.6	27.9	19.9	12.6
ψ_JB	Junction-to-board characterization parameter	53.1	54.8	35.7	47.5	77.9

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.