ZHCSS65N october   1995  – may 2023 SN54AHCT32 , SN74AHCT32

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Noise Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • J|14
  • FK|20
  • W|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC(1)SN74AHCT32UNIT
DDBDGVNNSPWRGYBQA
14 PINS
RθJAJunction-to-ambient thermal resistance97.5109.5133.359.792.2125.159.0

88.3

°C/W
RθJC(top)Junction-to-case (top) thermal resistance58.762.155.647.349.853.772.5

90.9

RθJBJunction-to-board thermal resistance51.856.966.339.551.066.935.0

56.8

ψJTJunction-to-top characterization parameter22.622.67.832.415.77.63.9

9.9

ψJBJunction-to-board characterization parameter51.656.356.639.450.666.335.1

56.7

RθJC(bot)Junction-to-case (bottom) thermal resistance15.4

33.4

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).