ZHCSLO1D September   1988  – February 2021 SN74BCT374

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
    1.     4
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions (1)
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bipolar Push-Pull Outputs
      2. 8.3.2 Standard CMOS Inputs
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
        1. 9.2.2.1 Power Considerations
        2. 9.2.2.2 Output Considerations
        3. 9.2.2.3 Input Considerations
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • W|20
  • J|20
  • FK|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision C (March 2003) to Revision D (February 2021)

  • 更新了整个文档的表、图和交叉参考的编号格式Go
  • 应用 部分添加了新的应用Go
  • 删除了说明 部分中的订购信息功能Go
  • 说明 部分添加了器件信息Go
  • Moved package thermal impedance, ΘJA for the DW, N, and NS packages to Section 6.4 Go
  • Added ESD Ratings sectionGo
  • Added Thermal Information sectionGo
  • Changed IOS(min) value From: –100 mA To: –50 mA Go
  • Added Timing Requirements, Switching Characteristics, and Typical Characteristics sectionsGo
  • Added Detailed Description sectionGo
  • Added Application and Implementation sectionGo
  • Added Power Supply Recommendations and Layout sectionsGo

Changes from Revision B (April 1994) to Revision C (March 2003)

  • 说明 部分添加了订购信息Go
  • Added package thermal impedance, ΘJA for the DW, N, and NS packagesGo

Changes from Revision A (November 1993) to Revision B (April 1994)

  • 首次公开发布量产数据表。Go