米6体育平台手机版

ZHCSP53G December 1982 – October 2021 SN54HC138 , SN74HC138

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information: SN74HC138

THERMAL METRIC⁽¹⁾		SN74HC138					UNIT
		D (SOIC)	DB (SSOP)	N (PDIP)	NS (SO)	PW (TSSOP)
		16 PINS	16 PINS	16 PINS	16 PINS	16 PINS
R_θJA	Junction-to-ambient thermal resistance	87.3	104.3	54.8	91.1	141.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	45.8	54.7	42.1	49.5	49.5	°C/W
R_θJB	Junction-to-board thermal resistance	44.8	54.9	34.8	51.5	59.6	°C/W
ψ_JT	Junction-to-top characterization parameter	14.2	17.7	27	17.8	6.9	°C/W
ψ_JB	Junction-to-board characterization parameter	44.5	54.4	34.7	51.2	59.1	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.