ZHCSQ31E December   1982  – February 2022 SN54HC166 , SN74HC166

PRODUCTION DATA  

  1. 特性
  2. 说明
  3. Revision History
  4. Pin Configuration and Functions
  5. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions (1)
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Timing Requirements
    6.     11
    7. 5.6 Switching Characteristics
    8. 5.7 Operating Characteristics
  6. Parameter Measurement Information
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. Power Supply Recommendations
  9. Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • J|16
  • FK|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

SNx4HC166 器件包含一个8位移位寄存器,具有一路串行输入和八路并行负载输入。

器件信息
零件编号 封装(1) 封装尺寸(标称值)
SN74HC166D SOIC (16) 9.90mm × 3.90mm
SN74HC166DB SSOP (16) 6.20mm × 5.30mm
SN74HC166N PDIP (16) 19.31mm × 6.35mm
SN74HC166NS SO (16) 6.20mm × 5.30mm
SN74HC166PW TSSOP (16) 5.00mm × 4.40mm
SN54HC166J CDIP (16) 24.38mm × 6.92mm
SNJ54HC166FK LCCC (20) 8.89mm × 8.45mm
SNJ54HC166J CFP (16) 10.16mm × 6.73mm
如需了解所有可用封装,请参阅数据表末尾的可订购米6体育平台手机版_好二三四附录。
GUID-20210625-CA0I-L7TG-ZB7M-LCCTLXTNTDLS-low.png功能框图