ZHCSR06H March 1984 – December 2022 SN54HCT245 , SN74HCT245
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | SNx4HCT245 | UNIT | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| J (CDIP) |
W (CFP) |
FK (LCCC) |
DB (SSOP) |
DW (SOIC) |
N (PDIP) |
NS (SO) |
PW (TSSOP) |
DGS (VSSOP) |
|||
| 20 PINS | 20 PINS | 20 PINS | 20 PINS | 20 PINS | 20 PINS | 20 PINS | 20 PINS | 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | — | — | — | 84.6 | 70.4 | 43.4 | 68.9 | 94.9 | 118.4 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 38.7 | 60.8 | 37.1 | 44.3 | 36.5 | 29.5 | 34.7 | 30.2 | 57.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 49.8 | 100.4 | 36.1 | 40.2 | 38.1 | 24.3 | 36.4 | 45.7 | 73.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | — | — | — | 11.1 | 11.3 | 15 | 11.6 | 1.5 | 5.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | — | — | — | 39.7 | 37.7 | 24.2 | 36 | 45.1 | 72.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 11.5 | 8.5 | 4.3 | — | — | — | — | — | — | °C/W |