米6体育平台手机版

ZHCSPU5G December 1982 – October 2022 SN54HCT74 , SN74HCT74

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information

THERMAL METRIC		D (SOIC)	DB (SSOP)	N (PDIP)	NS (SO)	PW (TSSOP)	UNIT
THERMAL METRIC		14 PINS	14 PINS	14 PINS	14 PINS	14 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance^⁽¹⁾	138.7	109.8	61.1	88.4	114.7	°C/W
R_{θJC (top)}	Junction-to-case (top) thermal resistance	93.8	54.7	48.9	46	44.3	°C/W
R_θJB	Junction-to-board thermal resistance	94.7	58.6	40.9	48.9	57.6	°C/W
Ψ_JT	Junction-to-top characterization parameter	49.1	15.5	28.5	13.8	4.8	°C/W
Ψ_JB	Junction-to-board characterization parameter	94.3	58	40.6	48.4	57	°C/W
R_{θJC (bot)}	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.