ZHCSPJ9B February   2022  – December 2023 SN54SLC8T245-SEP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCCA = 0.7 V
    7. 5.7  Switching Characteristics, VCCA = 0.8 V
    8. 5.8  Switching Characteristics, VCCA = 0.9 V
    9. 5.9  Switching Characteristics, VCCA = 1.2 V
    10. 5.10 Switching Characteristics, VCCA = 1.5 V
    11. 5.11 Switching Characteristics, VCCA = 1.8 V
    12. 5.12 Switching Characteristics, VCCA = 2.5 V
    13. 5.13 Switching Characteristics, VCCA = 3.3 V
    14. 5.14 Operating Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Up-Translation and Down-Translation From 0.65 V to 3.6 V
      2. 7.3.2 Multiple Direction Control Pins
      3. 7.3.3 Ioff Supports Partial-Power-Down Mode Operation
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|24
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRICSN54SLC8T245-SEPUNIT
PW (TSSOP)
24 PINS
RθJAJunction-to-ambient thermal resistance102.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance45.9°C/W
RθJBJunction-to-board thermal resistance58.2°C/W
ψJTJunction-to-top characterization parameter6.9°C/W
ψJBJunction-to-board characterization parameter57.8°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A°C/W
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