Thermal shutdown prevents the device from reaching extreme junction temperatures by turning off the internal switches when the IC junction temperature exceeds 180°C (typical). In TSD, the switching stops immediately to prevent the internal MOSFETs from failing in either high ambient temperature operation conditions or due to self-heating from high switching current. To recover from thermal shut down condition, the junction temperature must be below the overtemperature protection falling threshold. When the junction temperature falls below 147°C (typical), the power FET switching is enabled.