ZHCSEQ7C February   2016  – December 2021 SN65DP141

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Switching Characteristics, I2C Interface
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DC and AC Independent Gain Control
      2. 8.3.2 Two-Wire Serial Interface and Control Logic
      3. 8.3.3 Bus Idle
      4. 8.3.4 Start Data Transfer
      5. 8.3.5 Stop Data Transfer
      6. 8.3.6 Data Transfer
      7. 8.3.7 Acknowledge
    4. 8.4 Device Functional Modes
      1. 8.4.1 TRACE and CABLE Equalization Modes
      2. 8.4.2 Control Modes
      3. 8.4.3 GPIO MODE
      4. 8.4.4 I2C Mode
    5. 8.5 Register Maps
      1. 8.5.1  Register 0x00 (General Device Settings) (offset = 00000000) [reset = 00000000]
      2. 8.5.2  Register 0x01 (Channel Enable) (offset = 00000000) [reset = 00000000]
      3. 8.5.3  Register 0x02 (Channel 0 Control Settings) (offset = 00000000) [reset = 00000000]
      4. 8.5.4  Register 0x03 (Channel 0 Enable Settings) (offset = 00000000) [reset = 00000000]
      5. 8.5.5  Register 0x05 (Channel 1 Control Settings) (offset = 00000000) [reset = 00000000]
      6. 8.5.6  Register 0x06 (Channel 1 Enable Settings) (offset = 00000000) [reset = 00000000]
      7. 8.5.7  Register 0x08 (Channel 2 Control Settings) (offset = 00000000) [reset = 00000000]
      8. 8.5.8  Register 0x09 (Channel 2 Enable Settings) (offset = 00000000) [reset = 00000000]
      9. 8.5.9  Register 0x0B (Channel 3 Control Settings) (offset = 00000000) [reset = 00000000]
      10. 8.5.10 Register 0x0C (Channel 3 Control Settings) (offset = 00000000) [reset = 00000000]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±2000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. .
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