ZHCSFS6B July 2016 – June 2018 SN65DSI85-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | SN65DSI85-Q1 | UNIT | |
---|---|---|---|
PAP (HTQFP) | |||
64 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 36.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 18.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 20.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.8 | °C/W |
ψJB | Junction-to-board characterization parameter | 20.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.2 | °C/W |