米6体育平台手机版

ZHCSRD4I July 2003 – January 2023 SN65HVD1176 , SN75HVD1176

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

D|8
- MSOI002K

散热焊盘机械数据 (封装 | 引脚)

订购信息

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN75HVD1176	SN65HVD1176	UNIT
		D (SOIC)	D (SOIC)
		8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance⁽²⁾	104.7	116.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	45.8	56.3	°C/W
R_θJB	Junction-to-board thermal resistance	45.9	63.4	°C/W
ψ_JT	Junction-to-top characterization parameter	5.7	8.8	°C/W
ψ_JB	Junction-to-board characterization parameter	45.2	62.2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

(2) The intent of R_θJA specification is solely for a thermal performance comparison of one package to another in a standardized environment. This methodology is not meant to and will not predict the performance of a package in an application-specific environment.