米6体育平台手机版

ZHCSPC1P February 2002 – February 2022 SN65HVD10 , SN65HVD11 , SN65HVD12 , SN75HVD10 , SN75HVD11 , SN75HVD12

PRODUCTION DATA

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		SNx5HVD1xx		UNIT
		D (SOIC)	P (PDIP)
		8 Pins	8 Pins
R_θJA	Junction-to-ambient thermal resistance	116.7	84.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	56.3	65.4	°C/W
R_θJB	Junction-to-board thermal resistance	63.4	62.1	°C/W
ψ_JT	Junction-to-top characterization parameter	8.8	31.3	°C/W
ψ_JB	Junction-to-board characterization parameter	62.6	60.4	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.