SLLS933G November   2008  – January 2015 SN65HVD233-HT

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Driver Electrical Characteristics
    6. 7.6  Receiver Electrical Characteristics
    7. 7.7  Driver Switching Characteristics
    8. 7.8  Receiver Switching Characteristics
    9. 7.9  Device Switching Characteristics
    10. 7.10 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 ISO 11898 Compliance of SN65HVD23x Family of 3.3-V CAN Transceivers
        1. 9.3.1.1 Differential Signal
          1. 9.3.1.1.1 Common-Mode Signal
        2. 9.3.1.2 Interoperability Of 3.3-V CAN in 5-V CAN Systems
    4. 9.4 Device Functional Modes
      1. 9.4.1 Function Tables
      2. 9.4.2 Equivalent Input and Output Schematic Diagrams
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Diagnostic Loopback
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Slope Control
        2. 10.2.2.2 Standby
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)(2)
MIN MAX UNIT
VCC Supply voltage range –0.3 7 V
Voltage range at any bus terminal (CANH or CANL) –36 36 V
Voltage input range, transient pulse (CANH and CANL) through 100 Ω (see Figure 19) –100 100 V
VI Input voltage range (D, R, RS, LBK) –0.5 7 V
IO Receiver output current –10 10 mA
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) CANH, CANL, and GND ±16000 V
All pins ±3000
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

TA = –55°C to 210°C
MIN MAX UNIT
VCC Supply voltage 3 3.6 V
Voltage at any bus terminal (separately or common mode) –7 12 V
VIH High-level input voltage D, LBK 2 5.5 V
VIL Low-level input voltage D, LBK 0 0.8 V
VID Differential input voltage –6 6 V
Resistance from RS to ground 0 100 kΩ
VI(Rs) Input voltage at RS for standby 0.75 VCC 5.5 V
IOH High-level output current Driver –50 mA
Receiver –10
IOL Low-level output current Driver 50 mA
Receiver 10
TJ Operating junction temperature 212 °C
TA Operating free-air temperature(1) –55 210 °C
(1) Maximum free-air temperature operation is allowed as long as the device maximum junction temperature is not exceeded.

7.4 Thermal Information

THERMAL METRIC(1) SN65HVD233-HT UNIT
D HJK/HKQ JDJ
8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 106.4 146.1 72.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 55.8 23.7 3.1
RθJB Junction-to-board thermal resistance 46.5 152.0 38.3
ψJT Junction-to-top characterization parameter 10.7 20.7 6.0
ψJB Junction-to-board characterization parameter 45.9 93.1 26.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Driver Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS TA = –55°C to 125°C TA = 175°C(1) TA = 210°C(2) UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
VO(D) Bus output voltage
(dominant)		 CANH D = 0 V, RS = 0 V,
See Figure 13 and Figure 14		 2.45 VCC 2.45 VCC 2.45 VCC V
CANL 0.5 1.25 0.5 1.25 0.5 1.25
VO Bus output voltage (recessive) CANH D = 3 V, RS = 0 V,
See Figure 13 and Figure 14		 2.3 2.3 2.3 V
CANL 2.3 2.3 2.3
VOD(D) Differential output voltage (Dominant) D = 0 V, RS = 0 V,
See Figure 13 and Figure 14		 1.5 2 3 1.4 1.75 3 1.4 1.75 3 V
D = 0 V, RS = 0 V,
See Figure 14 and Figure 15		 1.1 2 3 1.1 1.47 3 1.1 1.47 3
VOD Differential output voltage (Recessive) D = 3 V, RS = 0 V,
See Figure 13 and Figure 14		 –120 12 –120 12 –120 12 mV
D = 3 V, RS = 0 V, No load –0.5 0.05 –0.5 0.8 –0.5 1.2 V
VOC(pp) Peak-to-peak common-mode output voltage See Figure 21 1 1 1 V
IIH High-level input current D, LBK D = 2 V –30 30 –30 30 –30 30 μA
IIL Low-level input current D, LBK D = 0.8 V –30 30 –30 30 –30 30 μA
IOS Short-circuit output current VCANH = –7 V,
CANL open,
See Figure 24		 –250 –250 –250 mA
VCANH = 12 V,
CANL open,
See Figure 24		 1 1 1
VCANL = –7 V,
CANH open,
See Figure 24		 –1 –1 –1
VCANL = 12 V,
CANH open,
See Figure 24		 250 250 250
CO Output capacitance See receiver input capacitance
IIRs(s) RS input current for standby RS = 0.75 VCC –10 –10 –10 μA
ICC Supply current Standby RS = VCC, D = VCC,
LBK = 0 V		 200 600 400 600 400 600 μA
Dominant D = 0 V, No load,
LBK = 0 V, RS = 0 V		 6 6 6 mA
Recessive D =t VCC, No load,
LBK = 0 V, RS = 0 V		 6 6 6
(1) Minimum and maximum parameters are characterized for operation at TA = 175°C and production tested at TA = 125°C.
(2) Minimum and maximum parameters are characterized for operation at TA = 210°C but may not be production tested at that temperature. Production test limits with statistical guardbands are used to ensure high temperature performance.

7.6 Receiver Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS TA = –55°C to 125°C TA = 175°C(1) TA = 210°C(2) UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
VIT+ Positive-going input threshold voltage LBK = 0 V, See Table 1 620 900 600 900 600 900 mV
VIT– Negative-going input threshold voltage 500 715 500 725 500 725 mV
Vhys Hysteresis voltage
(VIT+ – VIT–)		 100 140 140 mV
VOH High-level output voltage IO = –4 mA, See Figure 18 2.4 2.4 2.4 V
VOL Low-level output voltage IO = 4 mA, See Figure 18 0.4 0.4 0.4 V
II Bus input current CANH or
CANL = 12 V		 Other bus
pin = 0 V,
D = 3 V,
LBK = 0 V,
RS = 0 V,		 140 500 140 500 140 500 μA
CANH or
CANL = 12 V,
VCC = 0 V		 200 600 200 700 200 800
CANH or
CANL = –7 V		 –610 –150 –610 –150 –610 –150
CANH or
CANL = –7 V,
VCC = 0 V		 –450 –130 –450 –130 –450 –130
CI Input capacitance
(CANH or CANL)		 Pin to ground,
VI = 0.4 sin (4E6πt) + 0.5 V,
D = 3 V, LBK = 0 V		 45 55 55 pF
CID Differential input capacitance Pin to pin,
VI = 0.4 sin (4E6πt) + 0.5 V,
D = 3 V, LBK = 0 V		 15 15 15 pF
RID Differential input resistance D = 3 V, LBK = 0 V 40 110 40 110 40 110 kΩ
RIN Input resistance
(CANH or CANL)		 20 51 19 51 18 51 kΩ
ICC Supply current Standby RS = VCC, D = VCC, LBK = 0 V 200 600 400 600 400 600 μA
Dominant D = 0 V, No load, RS = 0 V,
LBK = 0 V		 6 6 6 mA
Recessive D = VCC, No load, RS = 0 V,
LBK = 0 V		 6 6 6
(1) Minimum and maximum parameters are characterized for operation at TA = 210°C and are not chacterized or production tested at
TA = 175°C.
(2) Minimum and maximum parameters are characterized for operation at TA = 210°C but may not be production tested at that temperature. Production test limits with statistical guardbands are used to ensure high temperature performance.

7.7 Driver Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS TA = –55°C to 125°C TA = 175°C(1) TA = 210°C(2) UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
tPLH Propagation delay time,
low-to-high-level output		 RS = 0 V, See Figure 16 35 85 50 50 ns
RS with 10 kΩ to ground,
See Figure 16		 70 125 75 75
RS with 100 kΩ to ground,
See Figure 16		 500 870 500 500
tPHL Propagation delay time,
high-to-low-level output		 RS = 0 V,
See Figure 16		 70 120 70 70 ns
RS with 10 kΩ to ground,
See Figure 16		 130 180 130 130
RS with 100 kΩ to ground,
See Figure 16		 870 1200 870 870
tsk(p) Pulse skew
(|tPHL – tPLH|)		 RS = 0 V,
See Figure 16		 35 9 9 ns
RS with 10 kΩ to ground,
See Figure 16		 60 35 35
RS with 100 kΩ to ground,
See Figure 16		 370 475 475
tr Differential output signal rise time RS = 0 V, See Figure 16 20 70 20 75 20 75 ns
tf Differential output signal fall time 18 70 20 75 20 75
tr Differential output signal rise time RS with 10 kΩ to ground,
See Figure 16		 30 135 30 140 30 140 ns
tf Differential output signal fall time 30 135 30 140 30 140
tr Differential output signal rise time RS with 100 kΩ to ground,
See Figure 16		 250 1400 250 1400 250 1400 ns
tf Differential output signal fall time 350 1400 350 1400 350 1400
ten(s) Enable time from standby to dominant See Figure 20 0.6 1.5 0.6 1.5 0.6 1.5 μs
(1) Minimum and maximum parameters are characterized for operation at TA = 210°C but not production tested at TA = 175°C or 210°C.
(2) Minimum and maximum parameters are characterized for operation at TA = 210°C but may not be production tested at that temperature. Production test limits with statistical guardbands are used to ensure high temperature performance.

7.8 Receiver Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS TA = –55°C to 125°C TA = 175°C(1) TA = 210°C(2) UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
tPLH Propagation delay time, low-to-high-level output See Figure 18 35 60 50 60 50 60 ns
tPHL Propagation delay time, high-to-low-level output 35 60 45 60 45 60 ns
tsk(p) Pulse skew (|tPHL – tPLH|) 7 5 5 ns
tr Output signal rise time 2 6.5 6.5 8 6.5 8 ns
tf Output signal fall time 2 6.5 6.5 9 6.5 9 ns
(1) Minimum and maximum parameters are characterized for operation at TA = 210°C but not production tested at TA = 175°C or 210°C.
(2) Minimum and maximum parameters are characterized for operation at TA = 210°C but may not be production tested at that temperature. Production test limits with statistical guardbands are used to ensure high temperature performance.

7.9 Device Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS TA = –55°C to 125°C TA = 175°C(1) TA = 210°C(2) UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
t(LBK) Loopback delay, driver input to receiver output See Figure 23 7.5 15 12 15 12 15 ns
t(loop1) Total loop delay, driver input to receiver output, recessive to dominant RS = 0 V, See Figure 22 70 135 90 135 90 135 ns
RS with 10 kΩ to ground,
See Figure 22		 105 190 115 190 115 190
RS with 100 kΩ to ground,
See Figure 22		 535 1000 430 1000 430 1000
t(loop2) Total loop delay, driver input to receiver output, dominant to recessive RS = 0 V, See Figure 22 70 135 98 135 98 135 ns
RS with 10 kΩ to ground,
See Figure 22		 105 190 150 190 150 190
RS with 100 kΩ to ground,
See Figure 22		 535 1100 880 1200 880 1200
(1) Minimum and maximum parameters are characterized for operation at TA = 210°C but not production tested at TA = 175°C or 210°C.
(2) Minimum and maximum parameters are characterized for operation at TA = 210°C but may not be production tested at that temperature. Production test limits with statistical guardbands are used to ensure high temperature performance.
op_life_slls933.gif
A. See the Specificationsfor absolute maximum and minimum recommended operating conditions.
B. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life).
Figure 1. Operating Life Derating Chart
SN65HVD233HD, SN65HVD233SJD, SN65HVD233SKGDA, SN65HVD233SHKJ, SN65HVD233SHKQ

7.10 Typical Characteristics

recess_lls933.gif
Figure 2. Recessive-to-Dominant Loop Time vs Free-Air Temperature
tc_supp_lls557.gif
Figure 4. Supply Current vs Frequency
tc_driveh_lls557.gif
Figure 6. Driver High-Level Output Current vs High-Level Output Voltage
recl_lls933.gif
Figure 8. Receiver Low-to-High Propagation Delay vs Free-Air Temperature
drivl_lls933.gif
Figure 10. Driver Low-to-High Propagation Delay
vs Free-Air Temperature
tc_drivout_lls557.gif
Figure 12. Driver Output Current vs Supply Voltage
dominant_lls933.gif
Figure 3. Dominant-to-Recessive Loop Time vs Free-Air Temperature
tc_drivel_lls557.gif
Figure 5. Driver Low-Level Output Current vs Low-Level Output Voltage
diffout_lls933.gif
Figure 7. Differential Output Voltage vs Free-Air Temperature
rech_lls933.gif
Figure 9. Receiver High-to-Low Propagation Delay vs Free-Air Temperature
drivh_lls933.gif
Figure 11. Driver High-to-Low Propagation Delay
vs Free-Air Temperature
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