米6体育平台手机版

ZHCSJ17H November 2002 – November 2018 SN65HVD233 , SN65HVD234 , SN65HVD235

PRODUCTION DATA.

请参考 PDF 数据表获取器件具体的封装图。

over operating free-air temperature range (unless otherwise noted)

PARAMETERS		TEST CONDITIONS	VALUE	UNIT
R_θJA	Junction-to-ambient thermal resistance⁽¹⁾	Low-K⁽²⁾ board, no air flow	185	°C/W
R_θJA	Junction-to-ambient thermal resistance⁽¹⁾	High-K⁽³⁾ board, no air flow	101	°C/W
R_θJB	Junction-to-board thermal resistance	High-K⁽³⁾ board, no air flow	82.8	°C/W
R_θJC	Junction-to-case thermal resistance		26.5	°C/W
P_(AVG)	Average power dissipation	R_L = 60 Ω, R_S at 0 V, input to D a 1-MHz 50% duty cycle square wave V_CC at 3.3 V, T_A = 25°C	36.4	mW
T_(SD)	Thermal shutdown junction temperature		170	°C

(1) See SZZA003 for an explanation of this parameter.

(2) JESD51-3 low effective thermal conductivity test board for leaded surface mount packages.

(3) JESD51-7 high effective thermal conductivity test board for leaded surface mount packages.