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ZHCSRU4F November 2006 – March 2023 SN65HVD3080E , SN65HVD3083E , SN65HVD3086E

PRODUCTION DATA

1 特性
2 应用
3 说明
4 Revision History
5 Specifications
6 Parameter Measurement Information
7 Device Information
1. 7.1 Function Tables
2. 7.2 Equivalent Input and Output Schematic Diagrams
8 Application Information
1. 8.1 Hot-Plugging
9 Device and Documentation Support
10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)

DGS|10
- MPDS035C

散热焊盘机械数据 (封装 | 引脚)

订购信息

zhcsru4f_oa
zhcsru4f_pm

5.6 Thermal Information

THERMAL METRIC⁽¹⁾		D (SOIC)	DGS (VSSOP)	UNIT
THERMAL METRIC⁽¹⁾		14 PINS	10 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	93.2	75.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	47.5	22.0	°C/W
R_θJB	Junction-to-board thermal resistance	49.4	44.9	°C/W
ψ_JT	Junction-to-top characterization parameter	11.2	1.0	°C/W
ψ_JB	Junction-to-board characterization parameter	48.9	44.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.