米6体育平台手机版

PRODUCTION DATA

7.8 Thermal Characteristics

over operating free-air temperature range unless otherwise noted⁽¹⁾

PARAMETER		TEST CONDITIONS		MIN	TYP	MAX	UNIT
θ_JA	Junction−to−ambient thermal resistance	Low-K board	HVD51		230.8		°C/W
	Junction−to−ambient thermal resistance	Low-K board	HVD53, HVD54, HVD55, HVD52, HVD50		-
	Junction−to−ambient thermal resistance	High-K board	HVD51		135.1
			HVD50, HVD52		116.7
			HVD53, HVD54, HVD55		93.2
θ_JB	Junction−to−board thermal resistance	High-K board	HVD51		44.4
			HVD50, HVD52		63.4
			HVD53, HVD54, HVD55		49.4
θ_JC	Junction−to−case thermal resistance	No board	HVD51		43.5
			HVD50, HVD52		56.3
			HVD53, HVD54, HVD55		47.5
P_D	Device power dissipation	R_L= 60Ω, C_L = 50 pF, Input to D a 50% duty cycle square wave at indicated signaling rate	HVD50 (25Mbps)			420	mW
			HVD51 (10Mbps)			404
			HVD52 (1Mbps)			383
		R_L= 60Ω, C_L = 50 pF, DE at V_CCRE at 0 V, Input to D a 50% duty cycle square wave at indicated signaling rate	HVD53 (25Mbps)			420
			HVD54 (10Mbps)			404
			HVD55 (1Mbps)			383
T_A	Ambient air temperature	Low-K board, No airflow	HVD50	–40		55	°C
			HVD51, HVD52	–40		84
			HVD53, HVD54, HVD55	–40		85
		High-K board, No airflow	HVD50, HVD51, HVD52	–40		85
		High-K board, No airflow	HVD53, HVD54, HVD55	–40		85
T_JSD	Thermal shutdown junction temperature				165

(1) See Application Information section for an explanation of these parameters.