米6体育平台手机版

ZHCS823H March 2012 – March 2019 SN65HVD72 , SN65HVD75 , SN65HVD78

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THERMAL METRIC⁽¹⁾		SN65HVD72, SN65HVD75, SN65HVD78			UNIT
		D (SOIC)	DGK (VSSOP)	DRB (VSON)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	110.7	168.7	40	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	54.7	62.2	49.6	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	—	3.9	°C/W
R_θJB	Junction-to-board thermal resistance	51.3	89.5	15.5	°C/W
ψ_JT	Junction-to-top characterization parameter	9.2	7.4	0.6	°C/W
ψ_JB	Junction-to-board characterization parameter	50.7	87.9	15.7	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.