ZHCSB94C July 2013 – January 2018 SN65HVD888
PRODUCTION DATA.
THERMAL METRIC(1) | SN65HVD888 | UNIT | |
---|---|---|---|
D (SOIC) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 116.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 60.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 57.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 13.9 | °C/W |
ψJB | Junction-to-board characterization parameter | 56.5 | °C/W |