ZHCSTS0F October 1993 – November 2023 SN65LBC173 , SN75LBC173
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | SOIC (D) | PDIP (N) | UNIT | |
|---|---|---|---|---|
| 16 Pins | 16 Pins | |||
| R θJA | Junction-to-ambient thermal resistance | 84.6 | 60.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 43.5 | 48.1 | °C/W |
| R θJB | Junction-to-board thermal resistance | 43.1 | 40.6 | °C/W |
| ψ JT | Junction-to-top characterization parameter | 10.4 | 27.5 | °C/W |
| ψ JB | Junction-to-board characterization parameter | 42.8 | 40.3 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |