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ZHCSW12G October 2000 – April 2024 SN65LBC174A , SN75LBC174A

PRODUCTION DATA

1
1 特性
2 应用
3 说明
4 Pin Configuration and Functions
5 Specifications
6 Parameter Measure Information
7 Device Functional Modes
8 Application and Implementation
1. 8.1 Application Information
9 Device and Documentation Support
10Revision History
11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

N|16
DW|16
DW|20

散热焊盘机械数据 (封装 | 引脚)

DW|20
- QFND313D
DW|16
- QFND313D

订购信息

zhcsw12g_oa
zhcsw12g_pm

5.2 Dissipation Rating Table

Table 5-1 Dissipation Rating Table

PACKAGE⁽¹⁾	JEDEC BOARD MODEL	T_A ≤ 25°C POWER RATING	DERATING FACTOR ⁽²⁾ ABOVE T_A = 25°C	T_A = 70°C POWER RATING	T_A = 85°C POWER RATING
16 DW	LOW K	1200 mW	9.6 mW/°C	769 mW	625 mW
16 DW	HIGH K	2240 mW	17.9 mW/°C	1434 mW	1165 mW
20 DW	LOW K	1483 mW	11.86 mW/°C	949 mW	771 mW
20 DW	HIGH K	2753 mW	22 mW/°C	1762 mW	1432 mW
16 N	LOW K	1150 mW	9.2 mW/°C	736 mW	598 mW

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.

(2) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.