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ZHCSQI5I August 1990 – October 2022 SN55LBC176 , SN65LBC176 , SN75LBC176

PRODUCTION DATA

6.4 Thermal Information: SN65LBC176, SN75LBC176

THERMAL METRIC⁽¹⁾		D	P	UNIT
THERMAL METRIC⁽¹⁾		8 PINS		UNIT
R_θJA	Junction-to-ambient thermal resistance	116.7	65.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	56.3	54.6
R_θJB	Junction-to-board thermal resistance	63.4	42.1
ψ_JT	Junction-to-top characterization parameter	8.8	22.9
ψ_JB	Junction-to-board characterization parameter	62.6	41.6
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	n/a

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.