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ZHCSQI5I August 1990 – October 2022 SN55LBC176 , SN65LBC176 , SN75LBC176

PRODUCTION DATA

6.3 Thermal Information: SN55LBC176

THERMAL METRIC⁽¹⁾		FK	JG	UNIT
THERMAL METRIC⁽¹⁾		20 PINS	8 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	61.6	99.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	36.8	51.5
R_θJB	Junction-to-board thermal resistance	36.1	86.5
ψ_JT	Junction-to-top characterization parameter	31.0	23.7
ψ_JB	Junction-to-board characterization parameter	36.0	80.2
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	4.2	11.6

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.