ZHCSTJ8B May   2001  – October 2023 SN65LBC182 , SN75LBC182

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Dissipation Rating
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Driver Electrical Characteristics
    7. 5.7  Receiver Electrical Characteristics
    8. 5.8  Driver Switching Characteristics
    9. 5.9  Receiver Switching Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.3 Dissipation Rating

PACKAGE(2) TA ≤ 25°C POWER RATING DERATING FACTOR(1) ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING
D 725 mW 5.8 mW/°C 464 mW 377 mW
P 1150 mW 9.2 mW/°C 736 mW 598 mW
(1) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow.
(2) The maximum operating junction temperature is internally limited. Use the dissipation rating table to operate below this temperature
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