ZHCSN67N July   1997  – April 2021 SN55LVDS31 , SN65LVDS31 , SN65LVDS3487 , SN65LVDS9638

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings (1)
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: SN55LVDS31
    6. 7.6 Electrical Characteristics: SN65LVDSxxxx
    7. 7.7 Switching Characteristics: SN55LVDS31
    8. 7.8 Switching Characteristics: SN65LVDSxxxx
    9. 7.9 Typical Characteristics
      1. 7.9.1 17
  8. 8 Parameter Measurement Information
    1. 8.1 19
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Driver Disabled Output
      2. 9.3.2 NC Pins
      3. 9.3.3 Unused Enable Pins
      4. 9.3.4 Driver Equivalent Schematics
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Point-to-Point Communications
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Driver Supply Voltage
          2. 10.2.1.2.2 Driver Bypass Capacitance
          3. 10.2.1.2.3 Driver Output Voltage
          4. 10.2.1.2.4 Interconnecting Media
          5. 10.2.1.2.5 PCB Transmission Lines
          6. 10.2.1.2.6 Termination Resistor
          7. 10.2.1.2.7 Driver NC Pins
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Multidrop Communications
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Interconnecting Media
        3. 10.2.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 49
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Microstrip vs. Stripline Topologies
      2. 12.1.2 Dielectric Type and Board Construction
      3. 12.1.3 Recommended Stack Layout
      4. 12.1.4 Separation Between Traces
      5. 12.1.5 Crosstalk and Ground Bounce Minimization
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Other LVDS Products
    2. 13.2 Documentation Support
      1. 13.2.1 Related Information
      2. 13.2.2 接收文档更新通知
      3. 13.2.3 Related Links
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 静电放电警告
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PW|16
  • NS|16
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.5 Electrical Characteristics: SN55LVDS31

over operating free-air temperature range (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYP#SLLS2615010MAXUNIT
VODDifferential output voltage magnitudeRL = 100 Ω, See GUID-B3B7DE98-2A05-4F92-8965-472782070600.html#SLLS2619641247340454mV
ΔVODChange in differential output voltage magnitude between logic statesRL = 100 Ω, See GUID-B3B7DE98-2A05-4F92-8965-472782070600.html#SLLS2619641–5050mV
VOC(SS)Steady-state common-mode output voltageSee GUID-B3B7DE98-2A05-4F92-8965-472782070600.html#SLLS26121211.1251.21.375V
ΔVOC(SS)Change in steady-state common-mode output voltage between logic statesSee GUID-B3B7DE98-2A05-4F92-8965-472782070600.html#SLLS2612121–5050mV
VOC(PP)Peak-to-peak common-mode output voltageSee GUID-B3B7DE98-2A05-4F92-8965-472782070600.html#SLLS261212150150mV
ICCSupply currentVI = 0.8 or 2 V, Enabled, No load920mA
VI = 0.8 or 2 V, RL = 100 Ω, Enabled2535
VI = 0 or VCC, Disabled0.251
IIHHigh-level input currentVIH = 2420μA
IILLow-level input currentVIL = 0.8 V0.110μA
IOSShort-circuit output currentVO(Y) or VO(Z) = 0–4–24mA
VOD = 0±12
IOZHigh-impedance output currentVO = 0 or 2.4 V±1μA
IO(OFF)Power-off output currentVCC = 0, VO = 2.4 V±4μA
CiInput capacitance3pF
(1) All typical values are at TA = 25°C and with VCC = 3.3 V.
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