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SDLS049C December 1983 – November 2016 SN5414 , SN54LS14 , SN7414 , SN74LS14

PRODUCTION DATA.

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机械数据 (封装 | 引脚)

D|14
N|14
NS|14

散热焊盘机械数据 (封装 | 引脚)

订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
Supply voltage, V_CC⁽²⁾			7	V
Input voltage	SNx414		5.5	V
Input voltage	SNx4LS14		7	V
Junction temperature, T_J			150	°C
Storage temperature, T_stg		–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Voltage values are with respect to network ground terminal.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±1500	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±2000	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

			MIN	NOM	MAX	UNIT
V_CC	Supply voltage	SN5414, SN54LS14	4.5	5	5.5	V
V_CC	Supply voltage	SN7414, SN74LS14	4.75	5	5.25	V
I_OH	High-level output current	SN5414, SN7414			–0.8	mA
I_OH	High-level output current	SN54LS14, SN74LS14			–0.4	mA
I_OL	Low-level output current	SN5414, SN7414			16	mA
		SN54LS14			4
		SN74LS14			8
T_A	Operating free-air temperature	SN5414, SN54LS14	–55		125	°C
T_A	Operating free-air temperature	SN7414, SN74LS14	0		70	°C

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SNx414, SNx4LS14				UNIT
		D (SOIC)	DB (SSOP)	N (PDIP)	NS (SO)
		14 PINS	14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance⁽²⁾	90.1	105.4	54.9	88.8	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	50.3	57.3	42.5	46.5	°C/W
R_θJB	Junction-to-board thermal resistance	44.3	52.7	34.7	47.5	°C/W
ψ_JT	Junction-to-top characterization parameter	17.9	22.5	27.8	16.8	°C/W
ψ_JB	Junction-to-board characterization parameter	44.1	52.2	34.6	47.2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

(2) The package termal impedance is calculated in accordance with JESD 51-7.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER	TEST CONDITIONS⁽¹⁾		MIN	TYP⁽²⁾	MAX	UNIT
V_T+	V_CC= 5 V	SNx414	1.5	1.7	2	V
V_T+	V_CC= 5 V	SNx4LS14	1.4	1.6	1.9	V
V_T–	V_CC= 5 V	SNx414	0.6	0.9	1.1	V
V_T–	V_CC= 5 V	SNx4LS14	0.5	0.8	1	V
Hysteresis (V_T+ – V_T–)	V_CC= 5 V		0.4	0.8		V
V_IK	V_CC= MIN, I_I = –12 mA, SNx414				–1.5	V
V_IK	V_CC= MIN, I_I = –18 mA, SNx4LS14				–1.5	V
V_OH	V_CC= MIN, V_I = 0.6 V, I_OH = –0.8 mA, SNx414		2.4	3.4		V
V_OH	V_CC= MIN, V_I = 0.5 V, I_OH = –0.4 mA, SNx4LS14		2.4	3.4		V
V_OL	V_CC= MIN, V_I = 2 V, I_OL = 16 mA, SNx414			0.2	0.4	V
	V_CC= MIN, V_I = 1.9 V	I_OL = 4 mA, SNx4LS14		0.25	0.4
	V_CC= MIN, V_I = 1.9 V	I_OL = 8 mA, SN74LS14		0.35	0.5
I_T+	V_CC= 5 V, V_I = V_T+	SNx414		–0.43		mA
I_T+	V_CC= 5 V, V_I = V_T+	SNx4LS14		–0.14		mA
I_T–	V_CC= 5 V, V_I = V_T–	SNx414		–0.56		mA
I_T–	V_CC= 5 V, V_I = V_T–	SNx4LS14		–0.18		mA
I_I	V_CC= MAX, V_I = 5.5 V, SNx414				1	mA
I_I	V_CC= MAX, V_I = 7 V, SNx4LS14				0.1	mA
I_IH	V_CC= MAX, V_IH = 2.4 V, SNx414				40	µA
I_IH	V_CC= MAX, V_IH = 2.7 V, SNx4LS14				20	µA
I_IL	V_CC= MAX, V_IL = 0.4 V	SNx414		–0.8	–1.2	mA
I_IL	V_CC= MAX, V_IL = 0.4 V	SNx4LS14			–0.4	mA
I_OS⁽³⁾	V_CC= MAX	SNx414	–18		–55	mA
I_OS⁽³⁾	V_CC= MAX	SNx4LS14	–20		–100	mA
I_CCH	V_CC= MAX	SNx414		22	36	mA
I_CCH	V_CC= MAX	SNx4LS14		8.6	16	mA
I_CCL	V_CC= MAX	SNx414		39	60	mA
I_CCL	V_CC= MAX	SNx4LS14		12	21	mA