ZHCST93D October   2003  – October 2024 SN74AHC1G00-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, 3.3 V ± 0.3 V
    7. 5.7 Switching Characteristics, 5 V ± 0.5 V
    8. 5.8 Operating Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision C (October 2023) to Revision D (October 2024)

  • 封装信息 表、引脚配置和功能 部分以及热性能信息 表中添加了 DTX 封装Go

Changes from Revision B (February 2008) to Revision C (October 2023)

  • 添加了应用封装信息 表、引脚功能 表、ESD 等级 表、热性能信息 表、器件功能模式应用和实施 部分、器件和文档支持 部分以及封装和可订购信息 部分Go
  • 封装信息 表中添加了 DBV 封装Go
  • Added DBV package to Pin Configuration and Functions sectionGo
  • Added the thermal value for the DBV package: RθJA = 278.0 °C/W. Updated the thermal value for the DCK package: RθJA = 293.4 °C/W. Go