ZHCST98S March   1996  – February 2024 SN74AHC1G14

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 5.7 Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 5.8 Operating Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|5
  • DCK|5
  • DRL|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.2.2 Detailed Design Procedure

  1. Recommended input conditions:
    • For rise time and fall time specifications, see Δt/Δv in the Section 5.3 table.
    • For specified high and low levels, see VIH and VIL in the Section 5.3 table.
    • Inputs and outputs are overvoltage tolerant and can therefore go as high as 5.5 V at any valid VCC.
  2. Recommended output conditions:
    • Load currents must not exceed ±50 mA.
  3. Frequency selection criterion:
    • The effects of frequency upon the power consumption of the device can be studied in CMOS Power Consumption and CPD Calculation, SCAA035.
    • Added trace resistance and capacitance can reduce maximum frequency capability; follow the layout practices listed in the Section 8.4.1 section.
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