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ZHCSW35Q March 1996 – April 2024 SN74AHC1G32

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AHC1G32			UNIT
		DBV (SOT-23)	DCK (SC70)	DRL (SOT)
		5 PINS	5 PINS	5 PINS
R_θJA	Junction-to-ambient thermal resistance	278	293.4	328.7	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	180.5	208.8	105.1	°C/W
R_θJB	Junction-to-board thermal resistance	184.4	180.6	150.3	°C/W
ψ_JT	Junction-to-top characterization parameter	115.4	120.6	6.9	°C/W
ψ_JB	Junction-to-board characterization parameter	183.4	179.5	148.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.