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ZHCSTP9G June 1998 – July 2024 SN74AHC367

PRODUCTION DATA

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

PW|16
N|16
D|16

散热焊盘机械数据 (封装 | 引脚)

订购信息

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage		2	5.5	V
V_IH	High-level input voltage	V_CC = 2 V	1.5		V
		V_CC = 3 V	2.1
		V_CC = 5.5 V	3.85
V_IL	Low-level input voltage	V_CC = 2 V		0.5	V
		V_CC = 3 V		0.9
		V_CC = 5.5 V		1.65
V_I	Input voltage		0	5.5	V
V_O	Output voltage		0	V_CC	V
I_OH	High-level output current	V_CC = 2 V		–50	µA
		V_CC = 3.3 V ± 0.3 V		–4	mA
		V_CC = 5 V ± 0.5 V		–8	mA
I_OL	Low-level output current	V_CC = 2 V		50	µA
		V_CC = 3.3 V ± 0.3 V		4	mA
		V_CC = 5 V ± 0.5 V		8	mA
Δt/Δv	Input transition rise or fall rate	V_CC = 3.3 V ± 0.3 V		100	ns/V
Δt/Δv	Input transition rise or fall rate	V_CC = 5 V ± 0.5 V		20	ns/V
T_A	Operating free-air temperature		–40	85	°C

(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs.