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ZHCSUQ5A June 2003 – February 2024 SN74AHC4066

PRODUCTION DATA

请参考 PDF 数据表获取器件具体的封装图。

5.3 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AHC4066			UNIT
		D	PW	RGY
		14 PINS	14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	127.7	150.6	91.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	81.8	78.2	91.8	°C/W
R_θJC(bottom)	Junction-to-case (bottom) thermal resistance	N/A	N/A	50.0	°C/W
R_θJB	Junction-to-board thermal resistance	84.2	93.7	66.5	°C/W
ψ_JT	Junction-to-top characterization parameter	39.5	24.6	20.0	°C/W
ψ_JB	Junction-to-board characterization parameter	83.7	93.1	66.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.